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MSP430F67771AIPEUR

Texas Instruments

MSP430F67771AIPEUR by Texas Instruments

MSP430F67771AIPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and timers. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.610

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,725 parts In-Stock

1+ parts

$7.590

100+ parts

$6.188

1k+ parts

$4.125

10k+ parts

-

15,725

$7.590

$6.188

$4.125

-

Mouser Electronics

USA . 748 parts In-Stock

1+ parts

$9.630

100+ parts

$8.530

1k+ parts

$6.400

10k+ parts

-

748

$9.630

$8.530

$6.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 918 parts In-Stock

1+ parts

$7.210

100+ parts

-

1k+ parts

-

10k+ parts

-

918

$7.210

-

-

-

Vyrian

USA . 8,338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,338

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,948 parts In-Stock

1+ parts

$6.831

100+ parts

-

1k+ parts

-

10k+ parts

-

4,948

$6.831

-

-

-

Corohmni

South Africa . 150 parts In-Stock

1+ parts

$21.235

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$21.235

-

-

-

Parana Technologies

USA . 241 parts In-Stock

1+ parts

$26.007

100+ parts

-

1k+ parts

$26.598

10k+ parts

-

241

$26.007

-

$26.598

-

DigiPath Technology Company

USA . 1,554 parts In-Stock

1+ parts

$28.637

100+ parts

$26.346

1k+ parts

-

10k+ parts

-

1,554

$28.637

$26.346

-

-

ChromeModa Solutions

Germany . 4,327 parts In-Stock

1+ parts

$29.221

100+ parts

$23.961

1k+ parts

-

10k+ parts

-

4,327

$29.221

$23.961

-

-

IDEA Electronic Components Group

UK . 1,211 parts In-Stock

1+ parts

$29.221

100+ parts

$27.760

1k+ parts

$26.299

10k+ parts

-

1,211

$29.221

$27.760

$26.299

-

Infinite Electronics LLP (Excess)

. 13,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,157

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-

-

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Formix International (Excess)

India . 13,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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13,154

-

-

-

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Overview

Experience the next level of innovation with the MSP430F67771AIPEUR by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers cutting-edge solutions in the Other Function uPs,uCs & Peripheral ICs category. This versatile microprocessor circuit offers a wide range of applications, from industrial automation to consumer electronics. With its advanced technology and impressive features like 6-Ch 10-Bit ADC channels and 32 RAM words, this product provides unparalleled value and performance for customers looking to elevate their designs. Choose Texas Instruments for reliability, efficiency, and endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the product.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatile power options and compatibility with various voltage sources.

Bit Size: 16

The 16-bit size provides enhanced processing capabilities for the product, allowing for efficient operation and performance.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels allows for signal conversion, enabling the product to interact with analog signals.

ROM Words: 262144

With a large ROM memory capacity of 262144 words, the product can store a significant amount of program data for efficient operation.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced integrated functions and capabilities, making it suitable for a wide range of applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures stable and consistent power delivery to the product, optimizing performance and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67771AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67771AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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