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MSP430F6776IPZ

Texas Instruments

MSP430F6776IPZ by Texas Instruments

MSP430F6776IPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. Operating at up to 25 MHz, it supports I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring a low-profile package with a max clock frequency of 25 MHz.

Median Price

$8.048

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,990 parts In-Stock

1+ parts

$8.048

100+ parts

$6.561

1k+ parts

$4.374

10k+ parts

-

2,990

$8.048

$6.561

$4.374

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,766 parts In-Stock

1+ parts

$7.646

100+ parts

-

1k+ parts

-

10k+ parts

-

2,766

$7.646

-

-

-

Vyrian

USA . 6,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,790

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,919 parts In-Stock

1+ parts

$6.840

100+ parts

-

1k+ parts

-

10k+ parts

-

2,919

$6.840

-

-

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Corphita

USA . 3,464 parts In-Stock

1+ parts

$7.243

100+ parts

-

1k+ parts

-

10k+ parts

-

3,464

$7.243

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-

-

Corohmni

South Africa . 80 parts In-Stock

1+ parts

$7.770

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$7.770

-

-

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AZTECH Wire

Italy . 1,201 parts In-Stock

1+ parts

$21.140

100+ parts

-

1k+ parts

-

10k+ parts

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1,201

$21.140

-

-

-

Microchip USA

USA . 1,795 parts In-Stock

1+ parts

$22.020

100+ parts

$21.700

1k+ parts

$21.550

10k+ parts

$21.390

1,795

$22.020

$21.700

$21.550

$21.390

Parana Technologies

USA . 1,554 parts In-Stock

1+ parts

$69.611

100+ parts

-

1k+ parts

-

10k+ parts

-

1,554

$69.611

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-

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DigiPath Technology Company

USA . 325 parts In-Stock

1+ parts

$76.651

100+ parts

$70.519

1k+ parts

-

10k+ parts

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325

$76.651

$70.519

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-

ChromeModa Solutions

Germany . 6,653 parts In-Stock

1+ parts

$78.215

100+ parts

$64.136

1k+ parts

-

10k+ parts

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6,653

$78.215

$64.136

-

-

IDEA Electronic Components Group

UK . 2,207 parts In-Stock

1+ parts

$78.215

100+ parts

$74.304

1k+ parts

$70.394

10k+ parts

-

2,207

$78.215

$74.304

$70.394

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6776IPZ microprocessor! Designed with cutting-edge technology and superior quality, this powerful device is perfect for a wide range of applications in various industries. From IoT devices to consumer electronics, this microprocessor offers unmatched performance and efficiency. Experience seamless integration, enhanced functionality, and reliable operation with the MSP430F6776IPZ. Elevate your projects to new heights with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits inside, ensuring reliable performance.

Surface Mount: YES

Allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of compatible power sources, offering flexibility in design and usage.

Package Shape: SQUARE

Facilitates efficient placement and orientation on a PCB, optimizing space utilization.

Bit Size: 16

Enables processing and manipulation of data in 16-bit chunks, enhancing computing capabilities.

Power Supplies (V): 2/3.3

Supports multiple power supply options, enabling compatibility with various systems and environments.

No. of Terminals: 100

Provides ample connections for interfacing with other components and peripherals, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Offers a compact and streamlined package design, suitable for applications where space is a premium.

Minimum Supply Voltage: 1.8 V

Allows for operation at low power levels, conserving energy and extending battery life.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, enhancing reliability.

CPU Family: MSP430

Belongs to a renowned and proven family of microcontrollers, ensuring quality and industry-standard compatibility.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates additional functionality beyond basic processing, expanding the range of possible applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6776IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6776IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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