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MSP430F6776AIPZR

Texas Instruments

MSP430F6776AIPZR by Texas Instruments

MSP430F6776AIPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, BOR, DMA(3), RTC, TIMER(4), WDT peripherals. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$6.344

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,550 parts In-Stock

1+ parts

$6.344

100+ parts

$5.172

1k+ parts

$3.448

10k+ parts

-

3,550

$6.344

$5.172

$3.448

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,929 parts In-Stock

1+ parts

$6.027

100+ parts

-

1k+ parts

-

10k+ parts

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3,929

$6.027

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Vyrian

USA . 4,033 parts In-Stock

1+ parts

-

100+ parts

-

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4,033

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,727 parts In-Stock

1+ parts

$5.710

100+ parts

-

1k+ parts

-

10k+ parts

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3,727

$5.710

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-

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AZTECH Wire

Italy . 875 parts In-Stock

1+ parts

$14.680

100+ parts

-

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875

$14.680

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Corohmni

South Africa . 2,901 parts In-Stock

1+ parts

$24.398

100+ parts

-

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2,901

$24.398

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Microchip USA

USA . 2,333 parts In-Stock

1+ parts

$30.560

100+ parts

$30.370

1k+ parts

$30.280

10k+ parts

$30.180

2,333

$30.560

$30.370

$30.280

$30.180

Parana Technologies

USA . 1,098 parts In-Stock

1+ parts

$42.027

100+ parts

-

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-

10k+ parts

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1,098

$42.027

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ChromeModa Solutions

Germany . 5,986 parts In-Stock

1+ parts

$47.221

100+ parts

$38.721

1k+ parts

-

10k+ parts

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5,986

$47.221

$38.721

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IDEA Electronic Components Group

UK . 1,498 parts In-Stock

1+ parts

$47.221

100+ parts

$44.860

1k+ parts

$42.499

10k+ parts

-

1,498

$47.221

$44.860

$42.499

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QUARKTWIN TECHNOLOGY LTD

USA . 20,399 parts In-Stock

1+ parts

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20,399

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DigiPath Technology Company

USA . 383 parts In-Stock

1+ parts

-

100+ parts

$42.574

1k+ parts

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383

-

$42.574

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6776AIPZR, a cutting-edge microprocessor circuit designed to revolutionize your projects. With a wide range of peripherals and advanced technology, this device offers unparalleled performance and reliability. Whether you're working on IoT devices, consumer electronics, or industrial applications, this product's flexibility and efficiency will take your designs to the next level. Trust in Texas Instruments' legacy of excellence and innovation, and experience the difference with the MSP430F6776AIPZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits within the package, ensuring the product lasts longer and can withstand various environmental conditions.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this product energy efficient and capable of handling complex tasks efficiently.

Maximum Clock Frequency: 0.032768 MHz

With a high maximum clock frequency, this product can process data at a fast pace, improving overall performance and responsiveness.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The multiple connectivity options allow for seamless integration with other devices and systems, enhancing the product's versatility and compatibility.

ADC Channels: YES

The Analog to Digital Converters enable the product to accurately convert analog signals into digital data, making it suitable for applications requiring precise measurements and control.

DMA Channels: YES

The Direct Memory Access channels enhance data transfer efficiency by allowing the product to manage memory operations independently, reducing CPU load and speeding up data processing.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6776AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI;UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6776AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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