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MSP430F67751IPEUR

Texas Instruments

MSP430F67751IPEUR by Texas Instruments

MSP430F67751IPEUR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it's ideal for industrial applications requiring low power consumption and high performance. With a max supply voltage of 3.6 V, it offers efficient processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,148 parts In-Stock

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5,148

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Digiode

USA . 3,963 parts In-Stock

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3,963

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Distributors (Availability)

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One Stop Electronics

USA . 472 parts In-Stock

1+ parts

$13.000

100+ parts

-

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472

$13.000

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AZTECH Wire

Italy . 738 parts In-Stock

1+ parts

$16.036

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738

$16.036

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Corohmni

South Africa . 320 parts In-Stock

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$47.809

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320

$47.809

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Parana Technologies

USA . 2,301 parts In-Stock

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$70.921

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2,301

$70.921

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DigiPath Technology Company

USA . 842 parts In-Stock

1+ parts

$78.092

100+ parts

$71.845

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842

$78.092

$71.845

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ChromeModa Solutions

Germany . 6,936 parts In-Stock

1+ parts

$79.686

100+ parts

$65.343

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6,936

$79.686

$65.343

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IDEA Electronic Components Group

UK . 122 parts In-Stock

1+ parts

$79.686

100+ parts

$75.702

1k+ parts

$71.717

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122

$79.686

$75.702

$71.717

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Corphita

USA . 1,204 parts In-Stock

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Microchip USA

USA . 111 parts In-Stock

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111

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Overview

Experience the power of innovation with the MSP430F67751IPEUR by Texas Instruments. This top-of-the-line microprocessor circuit offers unparalleled quality and reliability, making it perfect for a wide range of applications. From smart home devices to industrial automation, this versatile product delivers exceptional performance and efficiency. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Upgrade your projects with the MSP430F67751IPEUR today and discover the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective, ideal for portable applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for greater flexibility in power requirements and compatibility with a wide range of systems.

No. of Terminals: 128

High number of terminals allows for versatile connectivity options and integration with various peripheral devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Speed: 25 rpm

Decent speed of 25 rpm ensures efficient processing and performance for various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67751IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67751IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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