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MSP430F6769AIPZ

Texas Instruments

MSP430F6769AIPZ by Texas Instruments

MSP430F6769AIPZ by Texas Instruments is a 16-bit microprocessor with 6-Ch 10-Bit ADC channels, 32 RAM words, and 524288 ROM words. It operates at a max frequency of 0.032768 MHz and has various peripherals like BOR, DMA(3), RTC, TIMER(4). Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and low profile package style.

Median Price

$15.366

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,703 parts In-Stock

1+ parts

$12.072

100+ parts

$10.544

1k+ parts

$7.272

10k+ parts

-

2,703

$12.072

$10.544

$7.272

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$18.660

100+ parts

$10.810

1k+ parts

$10.600

10k+ parts

-

4

$18.660

$10.810

$10.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,904 parts In-Stock

1+ parts

$11.468

100+ parts

-

1k+ parts

-

10k+ parts

-

1,904

$11.468

-

-

-

Vyrian

USA . 8,217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,217

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,226 parts In-Stock

1+ parts

$10.748

100+ parts

-

1k+ parts

-

10k+ parts

-

1,226

$10.748

-

-

-

Corphita

USA . 3,273 parts In-Stock

1+ parts

$10.865

100+ parts

-

1k+ parts

-

10k+ parts

-

3,273

$10.865

-

-

-

Microchip USA

USA . 1,760 parts In-Stock

1+ parts

$33.520

100+ parts

$33.040

1k+ parts

$32.800

10k+ parts

$32.560

1,760

$33.520

$33.040

$32.800

$32.560

Parana Technologies

USA . 917 parts In-Stock

1+ parts

$72.645

100+ parts

-

1k+ parts

-

10k+ parts

-

917

$72.645

-

-

-

DigiPath Technology Company

USA . 2,055 parts In-Stock

1+ parts

$79.992

100+ parts

$73.592

1k+ parts

-

10k+ parts

-

2,055

$79.992

$73.592

-

-

IDEA Electronic Components Group

UK . 1,936 parts In-Stock

1+ parts

$81.624

100+ parts

$77.543

1k+ parts

$73.462

10k+ parts

-

1,936

$81.624

$77.543

$73.462

-

ChromeModa Solutions

Germany . 1,459 parts In-Stock

1+ parts

$81.624

100+ parts

$66.932

1k+ parts

-

10k+ parts

-

1,459

$81.624

$66.932

-

-

Overview

Discover the innovative MSP430F6769AIPZ by Texas Instruments, a cutting-edge microprocessor circuit designed for a wide range of applications. With advanced features like multiple ADC and DMA channels, along with a variety of peripherals, this product offers unparalleled value to customers seeking high performance and reliability. Texas Instruments, known for their superior quality and expertise in semiconductor manufacturing, has crafted a top-of-the-line solution that guarantees optimal functionality and efficiency. From industrial to consumer electronics, the MSP430F6769AIPZ is the perfect choice for those looking to elevate their projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility in design.

Package Shape: SQUARE

The square package shape enables efficient use of space on the PCB, especially in compact designs.

Bit Size: 16

The 16-bit architecture provides higher processing capabilities compared to lower bit sizes, suitable for complex applications.

No. of Terminals: 100

Having 100 terminals allows for a sufficient number of connections for interfacing with other components and peripherals.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold finish ensures good conductivity and reliability in signal transmission.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, reducing CPU load and improving system performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6769AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6769AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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