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MSP430F6769AIPEU

Texas Instruments

MSP430F6769AIPEU by Texas Instruments

MSP430F6769AIPEU by Texas Instruments is a 16-bit MCU with 128 terminals, operating at up to 0.032768 MHz. Ideal for industrial applications, it features 6-Ch 10-Bit ADCs, 32 RAM words, and peripherals like BOR and RTC.

Median Price

$12.976

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,660 parts In-Stock

1+ parts

$12.976

100+ parts

$11.335

1k+ parts

$7.817

10k+ parts

-

1,660

$12.976

$11.335

$7.817

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,584 parts In-Stock

1+ parts

$12.327

100+ parts

-

1k+ parts

-

10k+ parts

-

4,584

$12.327

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-

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Vyrian

USA . 1,989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,989

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,214 parts In-Stock

1+ parts

$11.678

100+ parts

-

1k+ parts

-

10k+ parts

-

2,214

$11.678

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-

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Corohmni

South Africa . 832 parts In-Stock

1+ parts

$12.585

100+ parts

-

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-

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832

$12.585

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-

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AZTECH Wire

Italy . 407 parts In-Stock

1+ parts

$17.450

100+ parts

-

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407

$17.450

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-

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Microchip USA

USA . 1,740 parts In-Stock

1+ parts

$40.900

100+ parts

$40.310

1k+ parts

$40.020

10k+ parts

$39.730

1,740

$40.900

$40.310

$40.020

$39.730

Parana Technologies

USA . 664 parts In-Stock

1+ parts

$51.919

100+ parts

-

1k+ parts

-

10k+ parts

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664

$51.919

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DigiPath Technology Company

USA . 665 parts In-Stock

1+ parts

$57.169

100+ parts

$52.596

1k+ parts

-

10k+ parts

-

665

$57.169

$52.596

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ChromeModa Solutions

Germany . 6,807 parts In-Stock

1+ parts

$58.336

100+ parts

$47.836

1k+ parts

-

10k+ parts

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6,807

$58.336

$47.836

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IDEA Electronic Components Group

UK . 1,435 parts In-Stock

1+ parts

$58.336

100+ parts

$55.419

1k+ parts

$52.502

10k+ parts

-

1,435

$58.336

$55.419

$52.502

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Overview

Discover the innovative MSP430F6769AIPEU by Texas Instruments, a cutting-edge microprocessor circuit designed for a wide range of applications. With advanced technology and high-quality manufacturing, this product offers unparalleled performance and reliability. From industrial automation to consumer electronics, this versatile solution provides seamless connectivity and efficient operation. Experience the benefits of fast processing speeds, multiple peripherals, and low power consumption, making it the ideal choice for your next project. Upgrade your designs with the MSP430F6769AIPEU and unlock endless possibilities in the world of embedded systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product can handle higher voltage inputs, providing flexibility in usage.

Minimum Supply Voltage: 2.4 V

The ability to operate at a minimum supply voltage of 2.4V allows the product to function efficiently even in low power scenarios.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures high performance and reliable operation for the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, enhancing its overall efficiency.

Analog To Digital Convertors: 6-Ch 10-Bit

Having 6 channels with 10-bit resolution for analog to digital conversion allows for accurate and precise data acquisition.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options such as I2C, IRDA, SPI, and UART make the product versatile and compatible with various communication protocols.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus protocols like I2C, SPI, and UART ensures seamless integration with different devices and systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6769AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6769AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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