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MSP430F67681IPZ

Texas Instruments

MSP430F67681IPZ by Texas Instruments

MSP430F67681IPZ by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it supports I2C, SPI, UART bus compatibility for industrial applications requiring low power consumption. With a package size of 14x14 mm and terminal pitch of 0.5 mm, it's ideal for compact designs in various electronic devices.

Median Price

$15.366

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,400 parts In-Stock

1+ parts

$12.072

100+ parts

$10.544

1k+ parts

$7.272

10k+ parts

-

3,400

$12.072

$10.544

$7.272

-

Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$18.660

100+ parts

$10.810

1k+ parts

$10.640

10k+ parts

-

90

$18.660

$10.810

$10.640

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,559 parts In-Stock

1+ parts

$11.468

100+ parts

-

1k+ parts

-

10k+ parts

-

3,559

$11.468

-

-

-

Vyrian

USA . 2,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,584

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,068 parts In-Stock

1+ parts

$10.748

100+ parts

-

1k+ parts

-

10k+ parts

-

2,068

$10.748

-

-

-

Corphita

USA . 2,837 parts In-Stock

1+ parts

$10.865

100+ parts

-

1k+ parts

-

10k+ parts

-

2,837

$10.865

-

-

-

Microchip USA

USA . 1,454 parts In-Stock

1+ parts

$33.520

100+ parts

$33.040

1k+ parts

$32.800

10k+ parts

$32.560

1,454

$33.520

$33.040

$32.800

$32.560

Parana Technologies

USA . 713 parts In-Stock

1+ parts

$60.496

100+ parts

-

1k+ parts

-

10k+ parts

-

713

$60.496

-

-

-

DigiPath Technology Company

USA . 2,059 parts In-Stock

1+ parts

$66.614

100+ parts

$61.284

1k+ parts

-

10k+ parts

-

2,059

$66.614

$61.284

-

-

ChromeModa Solutions

Germany . 5,534 parts In-Stock

1+ parts

$67.973

100+ parts

$55.738

1k+ parts

-

10k+ parts

-

5,534

$67.973

$55.738

-

-

IDEA Electronic Components Group

UK . 480 parts In-Stock

1+ parts

$67.973

100+ parts

$64.574

1k+ parts

$61.176

10k+ parts

-

480

$67.973

$64.574

$61.176

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F67681IPZ. Designed for optimal performance and reliability, this versatile microprocessor circuit offers a wide range of applications in various industries. With advanced technology and top-notch quality, Texas Instruments ensures that customers receive unmatched value and benefits from this product. Experience seamless integration, high-speed processing, and precision control with the MSP430F67681IPZ, setting new standards in efficiency and effectiveness. Elevate your projects to new heights with the industry-leading solutions provided by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Easier and more efficient to install and replace compared to through-hole mounting.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs for flexibility in power supply options.

Bit Size: 16

Provides sufficient processing power for various applications.

Power Supplies (V): 2/3.3

Supports multiple power supply options for versatility in usage.

No. of Terminals: 100

Offers a high number of interfaces for connecting to external components.

Minimum Supply Voltage: 1.8 V

Allows for operation with lower voltage sources, improving energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures for reliable performance in various environments.

CPU Family: MSP430

Utilizes a reputable and efficient CPU architecture for optimal performance.

ADC Channels: YES

Includes analog-to-digital conversion capability for interfacing with analog sensors.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67681IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67681IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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