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MSP430F6767AIPEUR

Texas Instruments

MSP430F6767AIPEUR by Texas Instruments

MSP430F6767AIPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and WDT. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.169

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 954 parts In-Stock

1+ parts

$7.169

100+ parts

$5.844

1k+ parts

$3.896

10k+ parts

-

954

$7.169

$5.844

$3.896

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,219 parts In-Stock

1+ parts

$6.811

100+ parts

-

1k+ parts

-

10k+ parts

-

1,219

$6.811

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-

-

Vyrian

USA . 6,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,336

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,678 parts In-Stock

1+ parts

$6.452

100+ parts

-

1k+ parts

-

10k+ parts

-

4,678

$6.452

-

-

-

Corohmni

South Africa . 2,731 parts In-Stock

1+ parts

$6.554

100+ parts

-

1k+ parts

-

10k+ parts

-

2,731

$6.554

-

-

-

AZTECH Wire

Italy . 264 parts In-Stock

1+ parts

$18.670

100+ parts

-

1k+ parts

-

10k+ parts

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264

$18.670

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-

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Parana Technologies

USA . 1,068 parts In-Stock

1+ parts

$20.137

100+ parts

-

1k+ parts

$20.075

10k+ parts

-

1,068

$20.137

-

$20.075

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DigiPath Technology Company

USA . 2,073 parts In-Stock

1+ parts

$22.173

100+ parts

$20.400

1k+ parts

-

10k+ parts

-

2,073

$22.173

$20.400

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IDEA Electronic Components Group

UK . 1,954 parts In-Stock

1+ parts

$22.626

100+ parts

$21.495

1k+ parts

$20.363

10k+ parts

-

1,954

$22.626

$21.495

$20.363

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ChromeModa Solutions

Germany . 1,794 parts In-Stock

1+ parts

$22.626

100+ parts

$18.553

1k+ parts

-

10k+ parts

-

1,794

$22.626

$18.553

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Overview

Discover the innovative MSP430F6767AIPEUR by Texas Instruments, a cutting-edge microprocessor circuit designed for a wide range of applications. With advanced technology and high-quality manufacturing, this product offers customers unparalleled value and benefits. From its low profile package style to its impressive connectivity options, this device is versatile and reliable. Experience top performance with features such as DMA channels, ADC channels, and PWM channels. Trust Texas Instruments for premium quality and choose the MSP430F6767AIPEUR for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to external factors, making this product suitable for various applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this product energy-efficient and reliable.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the functionality and processing capabilities of this product, making it suitable for complex tasks.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The multiple connectivity options enable easy integration with other devices and systems, increasing the product's versatility and usability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6767AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6767AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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