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MSP430F6766IPEU

Texas Instruments

MSP430F6766IPEU by Texas Instruments

MSP430F6766IPEU by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. Operating at up to 25 MHz, it's ideal for industrial applications requiring a max supply voltage of 3.6 V. With I2C, SPI, and UART compatibility, this CMOS technology-based IC offers versatile performance in compact dimensions.

Median Price

$9.117

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 686 parts In-Stock

1+ parts

$9.117

100+ parts

$7.433

1k+ parts

$4.955

10k+ parts

-

686

$9.117

$7.433

$4.955

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,935 parts In-Stock

1+ parts

$8.661

100+ parts

-

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4,935

$8.661

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Vyrian

USA . 2,932 parts In-Stock

1+ parts

-

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2,932

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 303 parts In-Stock

1+ parts

$8.205

100+ parts

-

1k+ parts

-

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303

$8.205

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-

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Corohmni

South Africa . 2,226 parts In-Stock

1+ parts

$8.863

100+ parts

-

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2,226

$8.863

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AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$15.640

100+ parts

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368

$15.640

-

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Microchip USA

USA . 2,268 parts In-Stock

1+ parts

$28.730

100+ parts

$28.320

1k+ parts

$28.110

10k+ parts

$27.910

2,268

$28.730

$28.320

$28.110

$27.910

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$41.825

100+ parts

$38.061

1k+ parts

$34.296

10k+ parts

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100

$41.825

$38.061

$34.296

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Parana Technologies

USA . 1,505 parts In-Stock

1+ parts

$70.338

100+ parts

-

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1,505

$70.338

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DigiPath Technology Company

USA . 1,804 parts In-Stock

1+ parts

$77.450

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1,804

$77.450

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IDEA Electronic Components Group

UK . 2,069 parts In-Stock

1+ parts

$79.031

100+ parts

$75.079

1k+ parts

$71.128

10k+ parts

-

2,069

$79.031

$75.079

$71.128

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ChromeModa Solutions

Germany . 306 parts In-Stock

1+ parts

$79.031

100+ parts

$64.805

1k+ parts

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306

$79.031

$64.805

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Component Stockers USA

USA . 629 parts In-Stock

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629

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Overview

Unlock the power of innovation with the MSP430F6766IPEU by Texas Instruments. Designed with cutting-edge technology and superior quality, this microprocessor circuit offers unmatched performance in a compact package. Ideal for a wide range of applications, this device provides customers with reliable functionality, seamless integration, and exceptional value. Whether you're in the industrial, automotive, or consumer electronics industry, the MSP430F6766IPEU delivers the efficiency and flexibility you need to stay ahead of the competition. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuit, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the IC onto a PCB, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in powering the IC, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration onto a PCB and efficient use of space within electronic devices.

Bit Size: 16

The 16-bit architecture of the IC allows for faster processing and more complex operations compared to lower bit sizes.

Power Supplies (V): 2/3.3

The availability of multiple power supply options provides flexibility for different voltage requirements in various applications.

No. of Terminals: 128

The high number of terminals allows for versatile connectivity options and the ability to interface with a wide range of external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design with a low profile, making it suitable for space-constrained applications and enabling high-density PCB layouts.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the IC to withstand harsh environmental conditions, making it suitable for industrial applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it an excellent choice for energy-efficient designs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making the IC suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and resistance to corrosion, ensuring reliable connections for the IC.

ADC Channels: YES

The inclusion of ADC channels allows the IC to convert analog signals into digital data, enabling a wide range of sensing and measurement applications.

Terminal Position: QUAD

The quad terminal position offers multiple points of contact for enhanced stability and reliability in the IC's connection to the PCB.

ROM Words: 262144

The large ROM capacity allows for extensive program storage and operating data, enabling the IC to support complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The low seated height of the IC enables a slim profile for the overall electronic device, making it suitable for compact designs.

RAM Words: 16

While the RAM capacity is relatively small, it is sufficient for storing temporary data and variables during operation, supporting efficient processing.

Width: 14 mm

The compact width of the IC allows for efficient use of space on the PCB and within electronic devices, contributing to a streamlined design.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables fast processing and execution of instructions, enhancing the overall performance of the IC.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature allows for quick and efficient soldering of the IC during assembly, reducing production time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering of the IC onto the PCB, preventing solder joint defects and ensuring long-term durability.

Length: 20 mm

The moderate length of the IC allows for efficient placement on the PCB and compatibility with standard electronic device dimensions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with wide temperature fluctuations, making the IC suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the IC offers extensive processing capabilities and versatile peripheral connections, enabling it to support a wide range of applications.

RAM Bytes: 16384

The large RAM capacity allows for efficient data storage and manipulation during operation, supporting complex algorithms and multitasking capabilities.

Technology: CMOS

The CMOS technology used in the IC provides low power consumption and high noise immunity, contributing to energy-efficient and reliable operation.

Terminal Form: GULL WING

The gull-wing terminal form offers secure solder joints and easy inspection during assembly, ensuring reliable connections for the IC.

Maximum Supply Current: 11.75 mA

The low maximum supply current contributes to energy efficiency and minimizes power consumption during operation, making the IC suitable for battery-powered devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard power sources and stable operation of the IC across various applications.

ROM Programmability: FLASH

The flash ROM programmability allows for flexible and easy reprogramming of the IC, enabling firmware updates and customization of functionality.

Bus Compatibility: I2C; SPI; UART

The IC's compatibility with I2C, SPI, and UART communication protocols allows for seamless integration with a wide range of external devices and peripherals.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables a compact design and high-density interconnection on the PCB, contributing to efficient use of space in electronic devices.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the IC has a moderate sensitivity to moisture exposure, requiring standard handling and storage practices to prevent damage.

Speed: 25 rpm

The high speed of 25 rpm enables fast data processing and execution of operations, contributing to the overall efficiency and performance of the IC.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6766IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6766IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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