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MSP430F6765IPZ

Texas Instruments

MSP430F6765IPZ by Texas Instruments

MSP430F6765IPZ by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at up to 25 MHz, it supports I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring low power consumption and high clock frequency.

Median Price

$6.457

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,880 parts In-Stock

1+ parts

$7.684

100+ parts

$6.264

1k+ parts

$4.176

10k+ parts

-

4,880

$7.684

$6.264

$4.176

-

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$5.230

1k+ parts

$4.680

10k+ parts

$4.400

10

-

$5.230

$4.680

$4.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,946 parts In-Stock

1+ parts

$5.510

100+ parts

-

1k+ parts

-

10k+ parts

-

2,946

$5.510

-

-

-

Vyrian

USA . 6,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,585

-

-

-

-

Chip Stock

USA . 5,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,268 parts In-Stock

1+ parts

$5.220

100+ parts

-

1k+ parts

-

10k+ parts

-

3,268

$5.220

-

-

-

Corohmni

South Africa . 2,515 parts In-Stock

1+ parts

$6.548

100+ parts

-

1k+ parts

-

10k+ parts

-

2,515

$6.548

-

-

-

Microchip USA

USA . 2,817 parts In-Stock

1+ parts

$21.020

100+ parts

$20.720

1k+ parts

$20.570

10k+ parts

$20.420

2,817

$21.020

$20.720

$20.570

$20.420

AZTECH Wire

Italy . 196 parts In-Stock

1+ parts

$21.790

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$21.790

-

-

-

Parana Technologies

USA . 1,866 parts In-Stock

1+ parts

$41.987

100+ parts

-

1k+ parts

-

10k+ parts

-

1,866

$41.987

-

-

-

ChromeModa Solutions

Germany . 4,297 parts In-Stock

1+ parts

$47.176

100+ parts

$38.684

1k+ parts

-

10k+ parts

-

4,297

$47.176

$38.684

-

-

IDEA Electronic Components Group

UK . 889 parts In-Stock

1+ parts

$47.176

100+ parts

$44.817

1k+ parts

$42.458

10k+ parts

-

889

$47.176

$44.817

$42.458

-

DigiPath Technology Company

USA . 443 parts In-Stock

1+ parts

-

100+ parts

$42.534

1k+ parts

-

10k+ parts

-

443

-

$42.534

-

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430F6765IPZ. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. Ideal for a wide range of applications, this microprocessor circuit provides unmatched performance and reliability. Experience seamless operation and cutting-edge technology with the MSP430F6765IPZ, setting new standards in the industry. Elevate your projects with this exceptional product and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the integrated circuits inside the package.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of electrical systems and applications without risk of damage from overvoltage.

Bit Size: 16

Offers sufficient processing power and capabilities for a variety of tasks and functions.

Power Supplies (V): 2/3.3

Flexibility in power supply options allows for compatibility with different voltage sources and energy efficiency.

No. of Terminals: 100

Sufficient number of terminals for connectivity with other components, enabling communication and data transfer.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, suitable for industrial applications.

ADC Channels: YES

Ability to perform analog-to-digital conversion for sensor interfacing and data acquisition.

ROM Words: 131072

Large memory capacity for storing program instructions and data, enabling complex algorithms and functionalities.

RAM Words: 16

Sufficient random-access memory for temporary data storage and processing tasks.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integration of various peripheral functions enhances the capabilities and versatility of the microprocessor.

Speed: 25 rpm

Operates at a fast speed, facilitating quick data processing and response times.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6765IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6765IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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