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MSP430F6749AIPEUR

Texas Instruments

MSP430F6749AIPEUR by Texas Instruments

MSP430F6749AIPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at up to 0.032768 MHz. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$9.321

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,500 parts In-Stock

1+ parts

$9.321

100+ parts

$8.142

1k+ parts

$5.615

10k+ parts

-

6,500

$9.321

$8.142

$5.615

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,769 parts In-Stock

1+ parts

$8.855

100+ parts

-

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-

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1,769

$8.855

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Vyrian

USA . 8,310 parts In-Stock

1+ parts

-

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8,310

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,956 parts In-Stock

1+ parts

$8.389

100+ parts

-

1k+ parts

-

10k+ parts

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3,956

$8.389

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-

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Corohmni

South Africa . 105 parts In-Stock

1+ parts

$9.049

100+ parts

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105

$9.049

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AZTECH Wire

Italy . 918 parts In-Stock

1+ parts

$17.360

100+ parts

-

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918

$17.360

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Parana Technologies

USA . 1,607 parts In-Stock

1+ parts

$48.007

100+ parts

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1,607

$48.007

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DigiPath Technology Company

USA . 2,126 parts In-Stock

1+ parts

$52.862

100+ parts

-

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2,126

$52.862

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ChromeModa Solutions

Germany . 3,148 parts In-Stock

1+ parts

$53.941

100+ parts

$44.232

1k+ parts

-

10k+ parts

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3,148

$53.941

$44.232

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IDEA Electronic Components Group

UK . 167 parts In-Stock

1+ parts

$53.941

100+ parts

$51.244

1k+ parts

$48.547

10k+ parts

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167

$53.941

$51.244

$48.547

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Component Stockers USA

USA . 530 parts In-Stock

1+ parts

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530

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6749AIPEUR, a high-quality microprocessor circuit that offers unparalleled performance and reliability. Designed for industrial-grade applications, this microprocessor boasts advanced peripherals like BOR, DMA, RTC, and more, ensuring seamless connectivity and control. With its innovative technology and impressive features, the MSP430F6749AIPEUR provides exceptional value and benefits to customers seeking top-notch performance in their projects. Experience the power of Texas Instruments and take your designs to the next level with the MSP430F6749AIPEUR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for versatility in power requirements.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to design circuits and fit into compact spaces.

CPU Family: MSP430

MSP430 family is known for low power consumption and high efficiency, making the product energy-efficient.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the versatility and functionality of the product.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product efficient and reliable.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options allow for inter-device communication and seamless integration with various systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6749AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6749AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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