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MSP430F6748IPEU

Texas Instruments

MSP430F6748IPEU by Texas Instruments

MSP430F6748IPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at a max frequency of 25 MHz. It features 524288 ROM words and 16384 RAM bytes, suitable for industrial applications requiring low power consumption and high processing speeds. With compatibility for I2C, SPI, and UART buses, it offers versatile connectivity options in a compact flatpack package.

Median Price

$11.842

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$11.842

100+ parts

$10.344

1k+ parts

$7.134

10k+ parts

-

758

$11.842

$10.344

$7.134

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,907 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1,907

$11.250

-

-

-

Vyrian

USA . 7,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,758

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,247 parts In-Stock

1+ parts

$10.658

100+ parts

-

1k+ parts

-

10k+ parts

-

3,247

$10.658

-

-

-

Corohmni

South Africa . 5,203 parts In-Stock

1+ parts

$12.761

100+ parts

-

1k+ parts

-

10k+ parts

-

5,203

$12.761

-

-

-

AZTECH Wire

Italy . 248 parts In-Stock

1+ parts

$21.330

100+ parts

-

1k+ parts

-

10k+ parts

-

248

$21.330

-

-

-

Parana Technologies

USA . 343 parts In-Stock

1+ parts

$31.720

100+ parts

-

1k+ parts

$87.757

10k+ parts

-

343

$31.720

-

$87.757

-

ChromeModa Solutions

Germany . 3,479 parts In-Stock

1+ parts

$35.640

100+ parts

$29.225

1k+ parts

-

10k+ parts

-

3,479

$35.640

$29.225

-

-

IDEA Electronic Components Group

UK . 1,293 parts In-Stock

1+ parts

$35.640

100+ parts

$33.858

1k+ parts

$32.076

10k+ parts

-

1,293

$35.640

$33.858

$32.076

-

Microchip USA

USA . 2,179 parts In-Stock

1+ parts

$37.320

100+ parts

$36.790

1k+ parts

$36.520

10k+ parts

$36.260

2,179

$37.320

$36.790

$36.520

$36.260

DigiPath Technology Company

USA . 2,209 parts In-Stock

1+ parts

-

100+ parts

$32.133

1k+ parts

-

10k+ parts

-

2,209

-

$32.133

-

-

Overview

Unlock the power of innovation with the MSP430F6748IPEU by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures high-quality products that cater to a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. This versatile microprocessor circuit offers unmatched value with its reliable performance, low power consumption, and advanced technology. Whether you're designing IoT devices, consumer electronics, or industrial control systems, the MSP430F6748IPEU delivers the flexibility and efficiency you need to bring your ideas to life. Elevate your projects with this top-of-the-line solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy integration onto circuit boards, reducing assembly time and making it suitable for automated manufacturing processes.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of compatible power sources, giving flexibility in system design and operation.

Package Shape: RECTANGULAR

Provides a standard form factor for easy integration into various types of electronic devices.

Bit Size: 16

Offers sufficient processing power for handling a variety of tasks efficiently.

Power Supplies (V): 2/3.3

Supports multiple voltage options for compatibility with different power sources and system requirements.

No. of Terminals: 128

Provides ample connections for interfacing with external components, peripherals, and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and space-saving design, suitable for applications where size constraints are a consideration.

Minimum Supply Voltage: 1.8 V

Allows for operation at lower power levels, ideal for energy-efficient devices and battery-powered applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions, including industrial settings.

CPU Family: MSP430

Part of a well-known and established microcontroller family, offering proven reliability and performance.

Minimum Operating Temperature: -40 °C

Ensures operational functionality in extreme cold environments, making it suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and good conductivity for reliable electrical connections.

ADC Channels: YES

Includes analog-to-digital converters for interfacing with analog sensors and signals, expanding the product's capabilities.

Terminal Position: QUAD

Facilitates easy PCB layout and soldering, enhancing the product's assembly process.

ROM Words: 524288

Large memory capacity for storing program instructions and data, enabling complex applications and algorithms to be implemented.

Maximum Seated Height: 1.6 mm

Low-profile design for compact devices and applications with limited space constraints.

RAM Words: 16

Provides temporary storage for data processing, facilitating efficient operation and multitasking capabilities.

Width: 14 mm

Compact size for easy integration into small electronic devices and PCB designs.

Maximum Clock Frequency: 25 MHz

High clock speed for fast and responsive performance, suitable for real-time processing requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow processes during assembly, for reliable electrical connections.

Peak Reflow Temperature °C: 260

Capability to withstand high-temperature soldering processes, ensuring robust assembly and durability.

Length: 20 mm

Compact form factor for space-efficient designs and applications with size constraints.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with harsh conditions and temperature variations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrates additional functionality and interfaces, expanding the product's capabilities and versatility.

RAM Bytes: 16384

Generous memory capacity for storing and processing data, supporting complex algorithms and applications.

Technology: CMOS

Uses CMOS technology for low power consumption and high-speed performance, ideal for energy-efficient devices.

Terminal Form: GULL WING

Facilitates easy soldering and PCB assembly, ensuring reliable electrical connections and efficient manufacturing processes.

Maximum Supply Current: 11.75 mA

Efficient power consumption for energy-conscious designs and battery-powered applications.

Nominal Supply Voltage: 3.3 V

Optimal voltage level for stable and reliable operation, ensuring consistent performance.

ROM Programmability: FLASH

Allows for flexible and easy reprogramming of memory contents, enabling firmware updates and customization.

Bus Compatibility: I2C; SPI; UART

Supports popular communication interfaces for seamless integration with various peripherals and devices.

Terminal Pitch: 0.5 mm

Fine pitch for compact PCB layout and space-saving designs, suitable for high-density applications.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture and humidity, suitable for applications in challenging environmental conditions.

Speed: 25 rpm

Fast processing speed for efficient data handling and real-time applications, ensuring smooth operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6748IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6748IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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