Loading...

MSP430F67481IPEU

Texas Instruments

MSP430F67481IPEU by Texas Instruments

MSP430F67481IPEU by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it has a max supply voltage of 3.6 V and consumes up to 11.75 mA. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$11.183

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$11.183

100+ parts

$9.769

1k+ parts

$6.737

10k+ parts

-

758

$11.183

$9.769

$6.737

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,576 parts In-Stock

1+ parts

$10.624

100+ parts

-

1k+ parts

-

10k+ parts

-

1,576

$10.624

-

-

-

Vyrian

USA . 2,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,733

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,235 parts In-Stock

1+ parts

$10.065

100+ parts

-

1k+ parts

-

10k+ parts

-

3,235

$10.065

-

-

-

Andel Nordic

Denmark . 2,482 parts In-Stock

1+ parts

$10.141

100+ parts

-

1k+ parts

$9.735

10k+ parts

$9.735

2,482

$10.141

-

$9.735

$9.735

Corohmni

South Africa . 2,710 parts In-Stock

1+ parts

$12.761

100+ parts

-

1k+ parts

-

10k+ parts

-

2,710

$12.761

-

-

-

Parana Technologies

USA . 634 parts In-Stock

1+ parts

$19.703

100+ parts

-

1k+ parts

$19.691

10k+ parts

-

634

$19.703

-

$19.691

-

AZTECH Wire

Italy . 435 parts In-Stock

1+ parts

$19.900

100+ parts

-

1k+ parts

-

10k+ parts

-

435

$19.900

-

-

-

DigiPath Technology Company

USA . 449 parts In-Stock

1+ parts

$21.695

100+ parts

$19.960

1k+ parts

-

10k+ parts

-

449

$21.695

$19.960

-

-

ChromeModa Solutions

Germany . 3,115 parts In-Stock

1+ parts

$22.138

100+ parts

$18.153

1k+ parts

-

10k+ parts

-

3,115

$22.138

$18.153

-

-

IDEA Electronic Components Group

UK . 2,313 parts In-Stock

1+ parts

$22.138

100+ parts

$21.031

1k+ parts

$19.924

10k+ parts

-

2,313

$22.138

$21.031

$19.924

-

Microchip USA

USA . 1,578 parts In-Stock

1+ parts

$35.250

100+ parts

$34.740

1k+ parts

$34.490

10k+ parts

$34.240

1,578

$35.250

$34.740

$34.490

$34.240

Component Stockers USA

USA . 648 parts In-Stock

1+ parts

$176.250

100+ parts

-

1k+ parts

-

10k+ parts

-

648

$176.250

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F67481IPEU. This innovative microprocessor circuit offers unparalleled quality and reliability, backed by a trusted manufacturer. Ideal for a wide range of applications, this IC delivers high performance in a compact package. With advanced technology and impressive features, the MSP430F67481IPEU provides exceptional value and benefits to customers looking to take their projects to the next level. Experience the power of Texas Instruments with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the internal components of the product, making it reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V enables compatibility with a wide range of power sources, increasing flexibility in application.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and easy to handle during assembly, optimizing PCB layout.

Bit Size: 16

16-bit architecture allows for efficient processing and data manipulation, suitable for a variety of computing tasks.

Power Supplies (V): 2/3.3

Support for multiple power supply options (2V and 3.3V) offers compatibility with different power sources and allows for versatile integration.

No. of Terminals: 128

128 terminals provide ample connectivity options for interfacing with external devices and peripherals, enhancing the functionality of the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low-profile, fine-pitch package style enables compact design, efficient heat dissipation, and ease of soldering, making the product suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V ensures efficient operation even in low-power scenarios, providing reliability in diverse environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows for reliable performance in harsh environmental conditions, ensuring durability and stability of the product.

CPU Family: MSP430

Being part of the MSP430 CPU family indicates efficient power consumption, high performance, and robust peripherals, making this product suitable for portable and battery-powered applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality in extreme cold environments, expanding the range of applications where the product can be used.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides corrosion resistance and reliable electrical contacts, ensuring long-term performance and durability of the product.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, facilitating sensor interfacing and data acquisition, enhancing the product's versatility.

Terminal Position: QUAD

Quad terminal position offers stable and secure connection points, reducing the risk of signal interference and ensuring reliable operation of the product.

ROM Words: 524288

Large ROM capacity of 524288 words allows for storing a significant amount of program code and data, enabling complex applications and algorithms to be executed.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm facilitates compact and slim device designs, improving overall aesthetics and space utilization.

RAM Words: 16

16 RAM words provide fast and efficient memory access for temporary data storage, enhancing the product's performance in multitasking and data processing.

Width: 14 mm

Narrow width of 14mm makes the product suitable for applications with space constraints, enabling integration into compact electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum time at peak reflow temperature of 30 seconds ensures proper soldering and component assembly, resulting in reliable connections and long-term durability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C enables efficient soldering and component bonding, ensuring strong and durable connections for the product.

Length: 20 mm

Compact length of 20mm allows for flexibility in PCB layout and component placement, optimizing space utilization in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions, making the product suitable for industrial and automotive applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit as a peripheral IC provides advanced computing capabilities, enabling the product to perform complex tasks and execute sophisticated algorithms.

RAM Bytes: 16384

Large RAM capacity of 16384 bytes allows for efficient data storage and manipulation, supporting fast and responsive operation of the product.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and excellent noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering points and mechanical stability, ensuring reliable electrical connections and durability of the product.

Maximum Supply Current: 11.75 mA

Low maximum supply current of 11.75mA indicates efficient power usage, extending battery life and reducing energy costs in portable applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and reliable operation of the product across different operating conditions.

ROM Programmability: FLASH

ROM programmability using flash memory technology allows for easy and flexible firmware updates, enabling customization and adaptation to changing requirements.

Bus Compatibility: I2C; SPI; UART

Support for I2C, SPI, and UART bus protocols enhances connectivity and communication options, enabling seamless integration with various devices and peripherals.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm offers precise and compact soldering points, optimizing PCB layout and enabling high-density component placement.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, requiring standard handling and storage procedures to maintain product reliability and performance.

Speed: 25 rpm

Operating speed of 25 revolutions per minute (rpm) indicates efficient data processing and computation capabilities, suitable for real-time applications and time-sensitive tasks.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67481IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67481IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20