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MSP430F6747IPEU

Texas Instruments

MSP430F6747IPEU by Texas Instruments

MSP430F6747IPEU by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. Operating at a max frequency of 25 MHz, it is ideal for industrial applications requiring low power consumption and high performance. With I2C, SPI, and UART compatibility, this microprocessor offers versatile connectivity options in a compact FLATPACK package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,699 parts In-Stock

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6,699

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Digiode

USA . 3,766 parts In-Stock

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3,766

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Distributors (Availability)

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AZTECH Wire

Italy . 576 parts In-Stock

1+ parts

$6.285

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576

$6.285

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Corohmni

South Africa . 2,449 parts In-Stock

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$9.848

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$9.848

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One Stop Electronics

USA . 362 parts In-Stock

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$14.000

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362

$14.000

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Microchip USA

USA . 2,770 parts In-Stock

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$29.780

100+ parts

$29.360

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$29.150

10k+ parts

$28.930

2,770

$29.780

$29.360

$29.150

$28.930

Parana Technologies

USA . 769 parts In-Stock

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$50.862

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769

$50.862

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DigiPath Technology Company

USA . 1,854 parts In-Stock

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$56.005

100+ parts

$51.525

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1,854

$56.005

$51.525

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ChromeModa Solutions

Germany . 3,428 parts In-Stock

1+ parts

$57.148

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$46.861

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3,428

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$46.861

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IDEA Electronic Components Group

UK . 2,285 parts In-Stock

1+ parts

$57.148

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$54.291

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$51.433

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2,285

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$51.433

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Corphita

USA . 4,109 parts In-Stock

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Overview

Discover the power and versatility of the MSP430F6747IPEU by Texas Instruments, a top-tier manufacturer known for delivering quality products. This innovative microprocessor circuit offers a wide range of applications with its 16-bit technology, making it ideal for various projects. With a maximum clock frequency of 25 MHz and a low profile package style, this device promises optimal performance and efficiency. Experience seamless integration with I2C, SPI, and UART bus compatibility, while benefiting from the reliability and value that Texas Instruments is renowned for. Upgrade your designs today with the MSP430F6747IPEU and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good reliability and durability for the product.

Surface Mount: YES

Being surface mountable makes the product easier to assemble and saves space on the PCB.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, providing flexibility in system design.

Bit Size: 16

The 16-bit architecture allows for efficient processing and handling of data in the system.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes the product suitable for industrial applications where temperatures can vary.

ADC Channels: YES

The presence of ADC channels enables the product to perform analog-to-digital conversion, expanding its functionality.

ROM Words: 262144

With a large ROM capacity, the product can store a significant amount of program data, allowing for complex operations and functionalities.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC enhances the capabilities of the product for processing and control tasks.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Bus Compatibility: I2C; SPI; UART

The product's compatibility with multiple bus protocols allows for easy integration into systems using different communication interfaces.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6747IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6747IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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