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MSP430F67461AIPZ

Texas Instruments

MSP430F67461AIPZ by Texas Instruments

MSP430F67461AIPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.955

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 740 parts In-Stock

1+ parts

$8.955

100+ parts

$7.301

1k+ parts

$4.867

10k+ parts

-

740

$8.955

$7.301

$4.867

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,369 parts In-Stock

1+ parts

$8.507

100+ parts

-

1k+ parts

-

10k+ parts

-

3,369

$8.507

-

-

-

Vyrian

USA . 8,302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,302

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,260 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

2,260

$8.060

-

-

-

AZTECH Wire

Italy . 1,135 parts In-Stock

1+ parts

$18.220

100+ parts

-

1k+ parts

-

10k+ parts

-

1,135

$18.220

-

-

-

Microchip USA

USA . 1,658 parts In-Stock

1+ parts

$24.500

100+ parts

$24.150

1k+ parts

$23.970

10k+ parts

$23.800

1,658

$24.500

$24.150

$23.970

$23.800

Corohmni

South Africa . 588 parts In-Stock

1+ parts

$43.660

100+ parts

-

1k+ parts

-

10k+ parts

-

588

$43.660

-

-

-

Parana Technologies

USA . 717 parts In-Stock

1+ parts

$51.992

100+ parts

$4,828.248

1k+ parts

$46.793

10k+ parts

-

717

$51.992

$4,828.248

$46.793

-

DigiPath Technology Company

USA . 200 parts In-Stock

1+ parts

$57.250

100+ parts

$52.670

1k+ parts

-

10k+ parts

-

200

$57.250

$52.670

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-

ChromeModa Solutions

Germany . 5,799 parts In-Stock

1+ parts

$58.418

100+ parts

$47.903

1k+ parts

-

10k+ parts

-

5,799

$58.418

$47.903

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IDEA Electronic Components Group

UK . 2,210 parts In-Stock

1+ parts

$58.418

100+ parts

$55.497

1k+ parts

$52.576

10k+ parts

-

2,210

$58.418

$55.497

$52.576

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QUARKTWIN TECHNOLOGY LTD

USA . 4,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,603

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430F67461AIPZ, a high-quality microprocessor circuit designed for a wide range of applications. With cutting-edge technology and advanced features such as multiple ADC channels, PWM channels, and connectivity options like I2C and SPI, this industrial-grade device offers unparalleled performance and flexibility. Whether you're working on IoT devices, wearable tech, or smart home solutions, the MSP430F67461AIPZ delivers the power and reliability you need to bring your ideas to life. Choose Texas Instruments for top-tier innovation and make your vision a reality today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the IC, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of compatible power sources, making the IC versatile and suitable for various applications.

Bit Size: 16

A higher bit size allows for more complex calculations and operations to be performed, making the IC suitable for advanced tasks.

ADC Channels: YES

The presence of Analog to Digital Converters (ADC) allows the IC to interface with analog sensors and signals, increasing its functionality and usability in diverse systems.

Maximum Clock Frequency: 0.032768 MHz

With a relatively high maximum clock frequency, this IC can handle tasks requiring fast processing speeds and real-time operations efficiently.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The multiple connectivity options enable seamless communication with other devices and peripherals, enhancing the versatility and compatibility of the IC.

RAM Bytes: 16384

With a large RAM capacity, the IC can store and process a significant amount of data at once, enabling it to handle complex algorithms and multitasking effectively.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67461AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67461AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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