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MSP430F67461AIPEUR

Texas Instruments

MSP430F67461AIPEUR by Texas Instruments

MSP430F67461AIPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.590

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 223,774 parts In-Stock

1+ parts

$7.590

100+ parts

$6.188

1k+ parts

$4.125

10k+ parts

-

223,774

$7.590

$6.188

$4.125

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,182 parts In-Stock

1+ parts

$7.210

100+ parts

-

1k+ parts

-

10k+ parts

-

3,182

$7.210

-

-

-

Vyrian

USA . 2,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,333

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,428 parts In-Stock

1+ parts

$6.831

100+ parts

-

1k+ parts

-

10k+ parts

-

3,428

$6.831

-

-

-

AZTECH Wire

Italy . 443 parts In-Stock

1+ parts

$8.220

100+ parts

-

1k+ parts

-

10k+ parts

-

443

$8.220

-

-

-

Microchip USA

USA . 1,649 parts In-Stock

1+ parts

$20.880

100+ parts

$20.590

1k+ parts

$20.440

10k+ parts

$20.290

1,649

$20.880

$20.590

$20.440

$20.290

Parana Technologies

USA . 1,718 parts In-Stock

1+ parts

$36.866

100+ parts

-

1k+ parts

-

10k+ parts

-

1,718

$36.866

-

-

-

ChromeModa Solutions

Germany . 5,743 parts In-Stock

1+ parts

$41.422

100+ parts

$33.966

1k+ parts

-

10k+ parts

-

5,743

$41.422

$33.966

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-

IDEA Electronic Components Group

UK . 884 parts In-Stock

1+ parts

$41.422

100+ parts

$39.351

1k+ parts

$37.280

10k+ parts

-

884

$41.422

$39.351

$37.280

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Corohmni

South Africa . 2,872 parts In-Stock

1+ parts

$71.948

100+ parts

-

1k+ parts

-

10k+ parts

-

2,872

$71.948

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-

-

DigiPath Technology Company

USA . 1,687 parts In-Stock

1+ parts

-

100+ parts

$37.346

1k+ parts

-

10k+ parts

-

1,687

-

$37.346

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-

Overview

Discover the unparalleled quality and innovation of the MSP430F67461AIPEUR by Texas Instruments. This cutting-edge microprocessor circuit offers a wide range of applications in various industries, providing customers with exceptional value and benefits. With advanced features like multiple ADC channels, PWM channels, and connectivity options, this MICROPROCESSOR CIRCUIT is designed to meet all your performance needs. Trust Texas Instruments for reliability and excellence in every aspect of your projects. Elevate your designs with the MSP430F67461AIPEUR and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the integrated circuits, making the product reliable for long-term use.

Maximum Supply Voltage: 3.6 V

Ability to handle a higher supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

ADC Channels: YES

Integrated Analog to Digital Converters enable the product to accurately measure analog signals, making it suitable for applications requiring sensor interfacing and data acquisition.

ROM Words: 262144

Large ROM capacity provides ample space for program storage, allowing for complex algorithms and applications to be implemented on the microprocessor circuit.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The product being a microprocessor circuit offers advanced processing capabilities and connectivity options, making it ideal for a wide range of embedded systems and IoT applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67461AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67461AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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