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MSC1211Y5PAGR

Texas Instruments

MSC1211Y5PAGR by Texas Instruments

The Texas Instruments MSC1211Y5PAGR is an 8051 microcontroller with 8-bit CPU, 16-bit address bus, and 1280 bytes of RAM. It operates at a max clock frequency of 40 MHz and has ADC/DAC channels for automotive applications. With a package style of flatpack/thin profile, it features a temperature grade suitable for harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,793 parts In-Stock

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2,793

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Vyrian

USA . 855 parts In-Stock

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855

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Distributors (Availability)

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One Stop Electronics

USA . 811 parts In-Stock

1+ parts

$2.000

100+ parts

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811

$2.000

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AZTECH Wire

Italy . 712 parts In-Stock

1+ parts

$10.041

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712

$10.041

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Parana Technologies

USA . 724 parts In-Stock

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$40.189

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724

$40.189

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DigiPath Technology Company

USA . 349 parts In-Stock

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$44.253

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$40.713

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349

$44.253

$40.713

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ChromeModa Solutions

Germany . 4,941 parts In-Stock

1+ parts

$45.156

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$37.028

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4,941

$45.156

$37.028

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IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$45.156

100+ parts

$42.898

1k+ parts

$40.640

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860

$45.156

$42.898

$40.640

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Corphita

USA . 861 parts In-Stock

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Microchip USA

USA . 141 parts In-Stock

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Overview

Unleash the power of innovation with the MSC1211Y5PAGR by Texas Instruments, a cutting-edge microcontroller that redefines excellence in performance and reliability. Crafted by the industry-leading manufacturer, this versatile device boasts unparalleled quality and precision, making it the ideal choice for a wide range of applications. From automotive systems to consumer electronics, this microcontroller offers unmatched value and benefits, providing customers with seamless integration, advanced functionality, and superior efficiency. Elevate your projects with the MSC1211Y5PAGR and experience the difference that world-class technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages, making it versatile for different power requirements in various applications.

Address Bus Width: 16

Large address bus width allows for accessing a larger memory space, enabling more complex and advanced functions.

Bit Size: 8

8-bit architecture provides a good balance between processing power and cost-efficiency for many embedded applications.

DAC Channels: YES

Built-in DAC channels enable the microcontroller to generate analog output signals, essential for many sensor interfacing and control applications.

Power Supplies (V): 3/5,5

Supports multiple power supply options, allowing for flexibility in design and compatibility with different power sources.

No. of Terminals: 64

Ample number of terminals offer extensive connectivity options for peripherals and external devices, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The package style ensures compatibility with modern assembly processes and compact PCB designs, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.75 V

Provides a reliable operating voltage range to prevent instability and ensure consistent performance under varying power conditions.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes the microcontroller suitable for demanding industrial and automotive environments.

CPU Family: 8051

Belonging to the popular 8051 CPU family ensures compatibility with a wide range of software tools and libraries, simplifying the development process.

Minimum Operating Temperature: -40 °C

Wide temperature range support allows for reliable operation in harsh environmental conditions, making it ideal for automotive and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances solderability and ensures long-term reliability in various operating conditions.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to convert analog signals from sensors into digital data, essential for measurement and control applications.

Terminal Position: QUAD

Quad terminal position provides secure mechanical connection and facilitates easy mounting on PCBs, ensuring stable operation in demanding environments.

ROM Words: 32768

Large ROM capacity allows for storing extensive program code and data, enabling complex functionalities and applications.

Maximum Seated Height: 1.2 mm

Low profile design with maximum seated height ensures compatibility with slim and compact device designs, saving space in the final product.

Width: 10 mm

Compact width dimension makes the microcontroller suitable for space-constrained applications and facilitates efficient integration into electronic devices.

External Data Bus Width: 8

Standard 8-bit external data bus width offers a balance between performance and cost-effectiveness, suitable for a wide range of embedded applications.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast processing speed and real-time operation, making the microcontroller suitable for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and reliability during the assembly process, preventing defects and ensuring quality.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with lead-free soldering processes, meeting modern industry standards and regulations.

Length: 10 mm

Compact length dimension makes the microcontroller suitable for small form factor designs and space-constrained applications.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification ensures reliable performance in automotive applications, meeting the industry's stringent requirements for durability and stability.

Peripheral IC Type: MICROCONTROLLER

Integrated peripheral ICs simplify circuit design and reduce the need for external components, optimizing the microcontroller's functionality and performance.

RAM Bytes: 1280

Sufficient RAM capacity allows for efficient data storage and processing, enabling multitasking and complex operations in embedded systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making it ideal for battery-powered and portable devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering, ensuring reliable connections and facilitating the assembly process.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, making it easy to integrate into existing systems.

PWM Channels: YES

Support for PWM channels allows for precise control of analog signals, enabling efficient motor control and power management in various applications.

ROM Programmability: FLASH

ROM programmability using FLASH technology enables easy firmware updates and customization, enhancing the microcontroller's flexibility and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Compact terminal pitch allows for high-density integration on PCBs, saving space and enabling smaller and more compact electronic devices.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates moderate moisture sensitivity, requiring standard handling precautions during storage and assembly to prevent damage and ensure reliability.

Speed: 40 rpm

High processing speed of 40 rpm allows for efficient data processing and real-time control, making the microcontroller suitable for time-sensitive applications.

No. of I/O Lines: 32

Ample number of I/O lines provide flexibility for interfacing with external devices and peripherals, enabling versatile connectivity options and extended functionality.

Technical Specifications

Microcontrollers MSC1211Y5PAGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5,5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1211Y5PAGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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