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MSC1200Y3PFBR

Texas Instruments

MSC1200Y3PFBR by Texas Instruments

The Texas Instruments MSC1200Y3PFBR is an 8-bit microcontroller with 8192 ROM words and 128 RAM bytes. Operating at a max clock frequency of 33 MHz, it features ADC and DAC channels for automotive applications. With a package style of flatpack, thin profile, fine pitch, this CMOS technology microcontroller has a temperature range from -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,902 parts In-Stock

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4,902

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Digiode

USA . 2,709 parts In-Stock

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2,709

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Distributors (Availability)

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One Stop Electronics

USA . 1,488 parts In-Stock

1+ parts

$2.000

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1,488

$2.000

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AZTECH Wire

Italy . 426 parts In-Stock

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$16.298

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426

$16.298

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Parana Technologies

USA . 1,139 parts In-Stock

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$58.852

100+ parts

$5,465.314

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$52.967

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1,139

$58.852

$5,465.314

$52.967

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DigiPath Technology Company

USA . 1,096 parts In-Stock

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$64.803

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$64.803

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ChromeModa Solutions

Germany . 5,028 parts In-Stock

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$66.126

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$54.223

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$66.126

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IDEA Electronic Components Group

UK . 1,184 parts In-Stock

1+ parts

$66.126

100+ parts

$62.820

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$59.513

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1,184

$66.126

$62.820

$59.513

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Component Stockers USA

USA . 274 parts In-Stock

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$99.990

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274

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A-Z Elektronik GmbH

Germany . 5,598 parts In-Stock

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5,598

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Corphita

USA . 2,918 parts In-Stock

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Microchip USA

USA . 485 parts In-Stock

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Overview

Experience the next level of performance with the Texas Instruments MSC1200Y3PFBR microcontroller. Crafted with precision and quality, this microcontroller offers unparalleled advantages in various applications. From automotive to industrial automation, this product delivers exceptional value with its cutting-edge technology and versatile features. Elevate your projects with the reliability and efficiency of Texas Instruments, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount design allows for easy and compact integration on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power input options and allows for compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape enables efficient use of board space and uniform placement within electronic systems.

Bit Size: 8

8-bit architecture offers a good balance between performance and cost, suitable for various embedded applications.

DAC Channels: YES

Inclusion of DAC channels allows for accurate analog output capabilities, expanding the range of possible applications.

Power Supplies (V): 3/5

Availability of both 3V and 5V power supplies provides flexibility in power management and compatibility with different voltage requirements.

No. of Terminals: 48

Having 48 terminals allows for connecting to a wide range of external components, peripherals, and interfaces, enhancing the product's versatility.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers a compact design for space-constrained applications and facilitates high-density mounting on PCBs.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage ensures reliable operation even in low-power scenarios, enhancing the product's efficiency and performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature provides robustness and reliability in harsh environmental conditions, making the product suitable for automotive and industrial applications.

CPU Family: 8051

Based on the 8051 CPU family, known for its time-tested architecture and wide industry support, ensuring compatibility with existing software and peripherals.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function reliably in extreme cold environments, expanding its usability in various industrial and outdoor settings.

ADC Channels: YES

Presence of ADC channels enables accurate analog-to-digital conversion, crucial for interfacing with external sensors and acquiring real-world data.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and soldering, ensuring easy installation and maintenance of the product in electronic systems.

ROM Words: 8192

Having 8192 ROM words offers ample storage capacity for program code and data storage, allowing for complex applications to be implemented on the microcontroller.

Maximum Seated Height: 1.2 mm

Low maximum seated height enables a slim profile, making the product suitable for space-constrained designs and portable devices.

Width: 7 mm

Compact width dimension allows for efficient use of board space and enables integration into small form factor electronic devices.

Maximum Clock Frequency: 33 MHz

High maximum clock frequency of 33 MHz provides fast processing speeds and responsive performance, making the product suitable for high-speed applications.

Length: 7 mm

Short length dimension helps in optimizing board space and facilitates compact system design, especially in applications with size constraints.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification ensures reliable operation in automotive environments subjected to temperature variations, vibration, and harsh conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller peripheral IC type, it is a complete computing system on a chip, suitable for embedded control applications requiring intelligence and processing capabilities.

RAM Bytes: 128

128 RAM bytes provide temporary data storage for runtime operations, enabling efficient processing and manipulation of data within the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital and analog circuits, making the product energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form enables secure soldering connections and reliable contact with the PCB, ensuring robust electrical connections and ease of assembly.

Nominal Supply Voltage: 5 V

Standard 5V nominal supply voltage simplifies power management and ensures compatibility with commonly used power sources and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates, enhancing the product's flexibility and adaptability to changing application requirements.

Terminal Pitch: 0.5 mm

Fine 0.5mm terminal pitch enables high-density mounting on PCBs, offering greater design flexibility and allowing for compact system integration.

Speed: 33 rpm

Operating at 33 rpm speed ensures efficient execution of instructions and fast response times, making the product suitable for real-time processing and control applications.

No. of I/O Lines: 16

Having 16 I/O lines provides sufficient interfacing capabilities with external devices, sensors, and peripherals, allowing for versatile connectivity and control options.

Technical Specifications

Microcontrollers MSC1200Y3PFBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

16

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSC1200Y3PFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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