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MSC1200Y2PFBTG4

Texas Instruments

MSC1200Y2PFBTG4 by Texas Instruments

Texas Instruments MSC1200Y2PFBTG4 is an 8051 microcontroller with 8-bit DAC and 256 bytes of RAM. It operates at a max clock frequency of 33 MHz, suitable for automotive applications requiring low power consumption. Features include 8-channel ADC, I2C/SPI/USART connectivity, and on-chip flash ROM programmability.

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1k+

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Vyrian

USA . 4,047 parts In-Stock

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Digiode

USA . 2,114 parts In-Stock

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2,114

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AZTECH Wire

Italy . 897 parts In-Stock

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$5.104

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897

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One Stop Electronics

USA . 820 parts In-Stock

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$14.000

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820

$14.000

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Parana Technologies

USA . 1,064 parts In-Stock

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$27.804

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$40.202

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$27.804

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DigiPath Technology Company

USA . 650 parts In-Stock

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$30.616

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650

$30.616

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ChromeModa Solutions

Germany . 6,916 parts In-Stock

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$31.241

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$25.618

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6,916

$31.241

$25.618

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IDEA Electronic Components Group

UK . 2,187 parts In-Stock

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$31.241

100+ parts

$29.679

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$28.117

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2,187

$31.241

$29.679

$28.117

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Corphita

USA . 608 parts In-Stock

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Overview

Unlock the power of innovative technology with the Texas Instruments MSC1200Y2PFBTG4 Microcontroller. Designed with precision and reliability in mind, this high-quality product offers endless possibilities for a wide range of applications. From automotive to industrial use, this microcontroller provides efficient performance and seamless connectivity with I2C, SPI, and USART interfaces. Experience the exceptional value and benefits this microcontroller brings, with low power mode, boundary scan capability, and a maximum clock frequency of 33 MHz. Trust in Texas Instruments to deliver cutting-edge solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the microcontroller, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile in various applications.

On Chip Data RAM Width: 8

The 8-bit data RAM width provides sufficient memory for processing and storing data, enhancing the microcontroller's performance.

Package Shape: SQUARE

The square package shape allows for easy integration into circuit designs, optimizing space and layout efficiency.

Bit Size: 8

Having an 8-bit architecture offers compatibility with a wide range of software and peripherals, making it a versatile choice for different projects.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to interface with analog devices, expanding its capabilities in signal processing applications.

Power Supplies (V): 3/5

Supporting multiple power supply options (3V and 5V) provides flexibility in power management, accommodating various system requirements.

No. of Terminals: 48

Having 48 terminals allows for ample connectivity options, enabling the microcontroller to interface with a diverse range of external components and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers compactness and space-saving benefits, ideal for applications with limited board space.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even with varying or lower power inputs.

Maximum Operating Temperature: 125 °C

Being able to operate at high temperatures makes this microcontroller suitable for demanding environments or industrial applications where heat resistance is crucial.

CPU Family: 8051

The 8051 CPU family is well-known for its reliability, performance, and wide availability of development tools, making it a popular choice for embedded systems.

No. of External Interrupts: 6

Having 6 external interrupts allows the microcontroller to respond quickly to external events or signals, enhancing real-time responsiveness in applications.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures makes this microcontroller suitable for harsh environments or outdoor settings where temperature fluctuations occur.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers high conductivity and corrosion resistance, ensuring reliable and long-lasting connections in the circuit.

ADC Channels: YES

Incorporating ADC channels allows the microcontroller to convert analog signals into digital data, enabling precise measurement and control in sensor-based applications.

Terminal Position: QUAD

The quad terminal position offers a secure and stable mounting arrangement, enhancing the overall mechanical stability of the microcontroller on the PCB.

ROM Words: 4096

With 4096 ROM words, this microcontroller can store program instructions and data for efficient execution of tasks, enabling complex algorithms to be implemented.

Maximum Seated Height: 1.2 mm

The low maximum seated height ensures compatibility with slim and compact designs, allowing for space-efficient integration in electronic devices.

Digital To Analog Convertors: 1-Ch 8-Bit

Featuring a digital-to-analog converter with 8-bit resolution allows for accurate analog output generation, essential for audio, sensor interfacing, and control applications.

Width: 7 mm

With a width of 7 mm, this microcontroller offers a compact form factor suitable for small-scale circuits, handheld devices, or space-constrained applications.

Boundary Scan: YES

Including boundary scan support simplifies testing and debugging processes during manufacturing and maintenance, improving overall product quality and reliability.

Peripherals: BOR, TIMER(3), WDT

Featuring built-in brown-out reset, multiple timers, and watchdog timer peripherals enhances the microcontroller's functionality and performance in various applications.

Maximum Clock Frequency: 33 MHz

Operating at a high maximum clock frequency of 33 MHz enables fast processing speeds, making this microcontroller suitable for applications requiring real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering during assembly, preventing thermal damage to the microcontroller.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this microcontroller can withstand the soldering process without compromising its performance or reliability.

Length: 7 mm

The 7 mm length offers a balanced form factor for space-saving PCB layouts, facilitating easier design integration and ensuring compatibility with various enclosure sizes.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade ensures that the microcontroller can withstand harsh environmental conditions typically encountered in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates essential peripherals and processing capabilities in a single chip, making it a cost-effective and compact solution for embedded systems.

No. of Timers: 3

Having 3 timers provides versatile timing and event management capabilities, enabling precise control and scheduling of tasks in time-critical applications.

RAM Bytes: 256

With 256 bytes of RAM, this microcontroller offers sufficient memory for temporary data storage and processing, enhancing the efficiency of algorithm execution.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital and analog components, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form offers secure soldering connections, easy inspection, and mechanical strength, ensuring reliable electrical contacts in the circuit.

Analog To Digital Convertors: 8-Ch 24-Bit

Featuring 8-channel analog-to-digital converters with 24-bit resolution enables high-precision analog signal acquisition, critical in data acquisition and measurement applications.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying circuit design and power management considerations.

Connectivity: I2C, SPI, USART

Supporting I2C, SPI, and USART connectivity options enables seamless communication with external devices, sensors, and peripherals, expanding the microcontroller's interfacing capabilities.

ROM Programmability: FLASH

Utilizing FLASH memory for ROM programmability offers fast and flexible program storage, allowing for easy updates and modifications to the firmware without requiring external programming devices.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller provides compatibility with standard PCB manufacturing processes and allows for high-density mounting, optimizing space utilization on the board.

Format: FIXED POINT

Operating in fixed-point format simplifies mathematical operations, improves computational efficiency, and reduces software complexity, making it suitable for real-time control applications.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates a moderate level of sensitivity to moisture, requiring standard handling and storage procedures to prevent damage during manufacturing and assembly.

Technical Specifications

Microcontrollers MSC1200Y2PFBTG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

6

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 24-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

MSC1200Y2PFBTG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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