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MSC1202Y2RHHRG4

Texas Instruments

MSC1202Y2RHHRG4 by Texas Instruments

The Texas Instruments MSC1202Y2RHHRG4 is an 8-bit microcontroller with DAC and ADC channels, operating at a max clock frequency of 33 MHz. Ideal for automotive applications, it features ROM programmability, 128 bytes of RAM, and operates within a temperature range of -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,415 parts In-Stock

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Digiode

USA . 1,917 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 763 parts In-Stock

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$9.834

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$9.834

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One Stop Electronics

USA . 944 parts In-Stock

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$19.000

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944

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Parana Technologies

USA . 2,104 parts In-Stock

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$27.609

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$37.888

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$27.609

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DigiPath Technology Company

USA . 670 parts In-Stock

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$30.401

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670

$30.401

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ChromeModa Solutions

Germany . 5,767 parts In-Stock

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$31.021

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$25.437

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$31.021

$25.437

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IDEA Electronic Components Group

UK . 184 parts In-Stock

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$31.021

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$29.470

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$27.919

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184

$31.021

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$27.919

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Component Stockers USA

USA . 742 parts In-Stock

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$99.990

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Corphita

USA . 2,986 parts In-Stock

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Microchip USA

USA . 369 parts In-Stock

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Overview

Unlock the full potential of your projects with the Texas Instruments MSC1202Y2RHHRG4 microcontroller. Crafted with precision by a trusted manufacturer, this versatile chip offers unparalleled performance and reliability in a compact package. Perfect for a wide range of applications, from automotive to industrial systems, this microcontroller boasts advanced features like DAC and ADC channels, 8-bit processing power, and high clock frequencies. Experience seamless integration and exceptional value with the MSC1202Y2RHHRG4 microcontroller - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto a circuit board, saving time and space.

Maximum Supply Voltage: 5.25 V

Provides a wide range of voltage tolerance, making it versatile and reliable in different power supply scenarios.

Package Shape: SQUARE

Square shape allows for easy integration into design layouts and saves space on the circuit board.

Bit Size: 8

8-bit processing capability for handling various data types and calculations efficiently.

DAC Channels: YES

Supports digital-to-analog conversion, enabling accurate control of analog signals.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, increasing compatibility with different systems.

No. of Terminals: 36

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles for different mounting and cooling options, offering flexibility in design.

Minimum Supply Voltage: 4.75 V

Allows operation at lower voltages while maintaining stability and performance.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, suitable for automotive and industrial applications.

CPU Family: 8051

Based on a widely-used and established architecture, offering compatibility and support for various software tools.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, suitable for outdoor or harsh environments.

ADC Channels: YES

Supports analog-to-digital conversion, essential for reading and processing analog sensor data.

Terminal Position: QUAD

Quad terminal position for stability and easy connectivity in a compact footprint.

ROM Words: 4096

Sufficient on-chip memory for storing program instructions and data.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications and efficient heat dissipation.

Width: 6 mm

Compact width for easy integration into a variety of electronic devices.

Maximum Clock Frequency: 33 MHz

High clock frequency for fast processing and response times in real-time applications.

Length: 6 mm

Compact length for space-saving designs and efficient board layout.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller with various peripherals for versatile and standalone operation.

RAM Bytes: 128

Adequate on-chip RAM for temporary data storage and processing during operation.

Technology: CMOS

CMOS technology for low power consumption and reliable operation in various environments.

Terminal Form: NO LEAD

Non-leaded terminals for compact and space-saving connections on the circuit board.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with many existing electronic systems.

ROM Programmability: FLASH

Flash ROM for re-programmability and flexibility in updating firmware and software.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density mounting and compact PCB design.

Speed: 33 rpm

High processing speed of 33 rotations per minute for fast data processing and execution.

No. of I/O Lines: 16

Sufficient I/O lines for interfacing with external devices and components in various applications.

Technical Specifications

Microcontrollers MSC1202Y2RHHRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N36

Length:

6 mm

No. of I/O Lines:

16

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Trade Compliance

MSC1202Y2RHHRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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