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MSC1200Y3PFBTG4

Texas Instruments

MSC1200Y3PFBTG4 by Texas Instruments

The Texas Instruments MSC1200Y3PFBTG4 is an 8-bit microcontroller with 256 bytes of RAM and 8192 ROM words. Operating at a max clock frequency of 33 MHz, it features ADC and DAC channels for automotive applications. With a temperature range from -40 to 125°C, this CMOS technology-based microcontroller is ideal for various automotive control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,256 parts In-Stock

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8,256

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Digiode

USA . 3,213 parts In-Stock

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3,213

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 535 parts In-Stock

1+ parts

$16.436

100+ parts

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535

$16.436

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One Stop Electronics

USA . 1,615 parts In-Stock

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$26.000

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1,615

$26.000

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Parana Technologies

USA . 235 parts In-Stock

1+ parts

$64.614

100+ parts

$6,000.390

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$58.153

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235

$64.614

$6,000.390

$58.153

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DigiPath Technology Company

USA . 1,500 parts In-Stock

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$71.148

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$65.456

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1,500

$71.148

$65.456

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ChromeModa Solutions

Germany . 3,466 parts In-Stock

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$72.600

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$59.532

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3,466

$72.600

$59.532

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IDEA Electronic Components Group

UK . 28 parts In-Stock

1+ parts

$72.600

100+ parts

$68.970

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$65.340

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28

$72.600

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$65.340

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Corphita

USA . 1,032 parts In-Stock

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1,032

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Overview

Experience the cutting-edge technology of the MSC1200Y3PFBTG4 by Texas Instruments, a top-tier microcontroller that exceeds all expectations. With a robust package body material and a wide range of applications, this microcontroller offers unparalleled performance and reliability. From automotive to industrial uses, this microcontroller is designed to meet your specific needs with ease. Trust in Texas Instruments' exceptional track record in manufacturing quality products, and unlock the full potential of your projects with the MSC1200Y3PFBTG4. Elevate your designs and make a lasting impact with this innovative microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material makes the microcontroller easy to handle and resistant to damage during handling and installation.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.25 V

Provides a wide operating voltage range, allowing flexibility in power supply options.

Bit Size: 8

Having 8-bit architecture makes it suitable for applications that do not require complex processing, making it a cost-effective choice.

DAC Channels: YES

Allows for analog output capabilities, enabling the microcontroller to interface with sensors and other analog devices.

Power Supplies (V): 3/5

Can operate on both 3V and 5V power supplies, offering compatibility with a wide range of systems and components.

No. of Terminals: 48

Sufficient number of terminals for various input and output connections, making it versatile for different applications.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for use in demanding environments without the risk of overheating.

CPU Family: 8051

Belonging to the well-established 8051 family ensures reliability, compatibility, and a wealth of resources and support for developers.

ADC Channels: YES

Presence of Analog-to-Digital Converter (ADC) channels allows for the microcontroller to read and process analog signals, enhancing its versatility.

ROM Words: 8192

Ample amount of Read-Only Memory (ROM) storage for storing program code and data, suitable for medium-sized applications.

Technical Specifications

Microcontrollers MSC1200Y3PFBTG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

16

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSC1200Y3PFBTG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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