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MSC1202Y3RHHR

Texas Instruments

MSC1202Y3RHHR by Texas Instruments

The Texas Instruments MSC1202Y3RHHR microcontroller features 8-bit DAC, 8-ch ADC, and 128 bytes of RAM. Ideal for automotive applications with a temperature range of -40 to 125°C. Offers connectivity via I2C, SPI, and USART interfaces for versatile usage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 5,070 parts In-Stock

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Vyrian

USA . 2,609 parts In-Stock

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2,609

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Digiode

USA . 1,378 parts In-Stock

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Nova Conductors

Japan . 26 parts In-Stock

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One Stop Electronics

USA . 1,525 parts In-Stock

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$4.000

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$4.000

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Ampacity Inc.

Singapore . 676 parts In-Stock

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$13.000

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676

$13.000

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AZTECH Wire

Italy . 555 parts In-Stock

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$14.065

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555

$14.065

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Corohmni

South Africa . 178 parts In-Stock

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$40.257

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178

$40.257

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Parana Technologies

USA . 2,310 parts In-Stock

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$73.282

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DigiPath Technology Company

USA . 589 parts In-Stock

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$80.692

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$80.692

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ChromeModa Solutions

Germany . 4,933 parts In-Stock

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$82.339

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$67.518

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$82.339

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IDEA Electronic Components Group

UK . 2,125 parts In-Stock

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$82.339

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$78.222

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$74.105

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Kepictronics

USA . 15,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,528 parts In-Stock

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Lixinc

USA . 11,703 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,097 parts In-Stock

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Argo Parts USA

USA . 1,576 parts In-Stock

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Continental Prestige Electronics

USA . 179 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Discover the MSC1202Y3RHHR by Texas Instruments, a top-quality microcontroller that offers exceptional value and benefits. Designed with cutting-edge technology, this product provides high performance and reliability for a wide range of applications. With its innovative features and advanced capabilities, this microcontroller is perfect for automotive use and beyond. Trust Texas Instruments to deliver superior quality and performance in every product, making the MSC1202Y3RHHR the ideal choice for your next project. Unlock the possibilities with this versatile microcontroller and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, making the product easier to integrate into circuit designs.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage ensures robust performance and compatibility with various power sources.

CPU Family: 8051

The 8051 CPU family is known for its reliability, versatility, and widespread use in embedded systems, making this microcontroller a trusted choice for various applications.

ADC Channels: YES

Having ADC (Analog to Digital Converter) channels allows the microcontroller to accurately convert analog signals to digital data, expanding its capability to interface with sensors and other analog devices.

ROM Programmability: FLASH

The ability to programm the ROM (Read-Only Memory) using FLASH technology offers flexibility and ease of updating the firmware, enabling customization and future-proofing of the product.

Technical Specifications

Microcontrollers MSC1202Y3RHHR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

36

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

MSC1202Y3RHHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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