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MSC1201Y3RHHRG4

Texas Instruments

MSC1201Y3RHHRG4 by Texas Instruments

The Texas Instruments MSC1201Y3RHHRG4 is an 8-bit microcontroller with DAC and ADC channels, operating at a max clock frequency of 33 MHz. Ideal for automotive applications, it features a CMOS technology, ROM programmability via FLASH, and 128 RAM bytes for efficient processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,786 parts In-Stock

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8,786

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Digiode

USA . 3,384 parts In-Stock

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3,384

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 697 parts In-Stock

1+ parts

$10.674

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-

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697

$10.674

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One Stop Electronics

USA . 1,141 parts In-Stock

1+ parts

$19.000

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1,141

$19.000

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Ampacity Inc.

Singapore . 1,225 parts In-Stock

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$30.000

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1,225

$30.000

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Parana Technologies

USA . 1,008 parts In-Stock

1+ parts

$52.582

100+ parts

$4,883.045

1k+ parts

$47.324

10k+ parts

-

1,008

$52.582

$4,883.045

$47.324

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DigiPath Technology Company

USA . 1,732 parts In-Stock

1+ parts

$57.899

100+ parts

$53.267

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1,732

$57.899

$53.267

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ChromeModa Solutions

Germany . 476 parts In-Stock

1+ parts

$59.081

100+ parts

$48.446

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476

$59.081

$48.446

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IDEA Electronic Components Group

UK . 45 parts In-Stock

1+ parts

$59.081

100+ parts

$56.127

1k+ parts

$53.173

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45

$59.081

$56.127

$53.173

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Continental Prestige Electronics

USA . 3,612 parts In-Stock

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Corphita

USA . 2,893 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,996 parts In-Stock

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Microchip USA

USA . 228 parts In-Stock

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228

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Overview

Unlock the potential of your projects with the MSC1201Y3RHHRG4 microcontroller from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. This microcontroller offers seamless integration and exceptional performance, making it the perfect choice for automotive electronics, consumer appliances, and industrial automation. With advanced features like DAC channels and ADC channels, this microcontroller provides unparalleled value and versatility to customers. Upgrade your designs with the MSC1201Y3RHHRG4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable material for long-lasting performance.

Surface Mount:

YES - Easy to install and saves space on PCB.

Maximum Supply Voltage:

5.25 V - Can handle higher voltage inputs for flexibility.

Package Shape:

SQUARE - Compact design for efficient use of space.

Bit Size:

8 - Ideal for handling basic tasks efficiently.

DAC Channels:

YES - Allows for analog signal conversion as needed.

Power Supplies (V):

3/5 - Compatible with different power sources.

No. of Terminals:

36 - Sufficient connectivity options for various components.

Package Style (Meter):

CHIP CARRIER - HEAT SINK/SLUG - VERY THIN PROFILE - Efficient heat dissipation for improved performance.

Minimum Supply Voltage:

4.75 V - Can operate reliably at lower voltage levels.

Maximum Operating Temperature:

125 °C - Suitable for extreme temperature environments.

CPU Family:

8051 - Reliable and widely-used processor family.

Minimum Operating Temperature:

40 °C - Can also function in cold conditions.

ADC Channels:

YES - Enables precise analog to digital conversions.

Terminal Position:

QUAD - Simplifies installation process.

ROM Words:

8192 - Abundant memory storage for data and programs.

Maximum Seated Height:

1 mm - Low profile for space-constrained applications.

Width:

6 mm - Compact dimensions for versatile placement.

Maximum Clock Frequency:

33 MHz - High speed capability for quick processing.

Length:

6 mm - Small footprint for efficient board layout.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive applications.

Peripheral IC Type:

MICROCONTROLLER - All-in-one solution for control needs.

RAM Bytes:

128 - Sufficient memory for temporary data storage.

Technology:

CMOS - Efficient power consumption and performance.

Terminal Form:

NO LEAD - Environmentally friendly design.

Nominal Supply Voltage:

5 V - Standard voltage range for compatibility.

ROM Programmability:

FLASH - Easy to update and reprogram memory contents.

Terminal Pitch:

0.5 mm - Fine pitch for compact layout design.

Speed:

33 rpm - Fast processing speed for rapid response.

No. of I/O Lines:

16 - Sufficient input/output options for connectivity.

Technical Specifications

Microcontrollers MSC1201Y3RHHRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N36

Length:

6 mm

No. of I/O Lines:

16

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Trade Compliance

MSC1201Y3RHHRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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