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MSC1202Y3RHHTG4

Texas Instruments

MSC1202Y3RHHTG4 by Texas Instruments

The Texas Instruments MSC1202Y3RHHTG4 is an 8-bit microcontroller with DAC and ADC channels, operating at a max clock frequency of 33 MHz. Ideal for automotive applications, it features ROM programmability, 128 bytes of RAM, and operates within a temperature range of -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,979 parts In-Stock

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Digiode

USA . 4,108 parts In-Stock

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4,108

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Distributors (Availability)

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AZTECH Wire

Italy . 571 parts In-Stock

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$8.251

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571

$8.251

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Ampacity Inc.

Singapore . 1,177 parts In-Stock

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$20.000

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$20.000

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One Stop Electronics

USA . 745 parts In-Stock

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$30.000

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745

$30.000

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Parana Technologies

USA . 1,240 parts In-Stock

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$41.654

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$41.654

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ChromeModa Solutions

Germany . 3,221 parts In-Stock

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$46.802

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$38.378

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$46.802

$38.378

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IDEA Electronic Components Group

UK . 1,690 parts In-Stock

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$46.802

100+ parts

$44.462

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$42.122

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1,690

$46.802

$44.462

$42.122

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Corohmni

South Africa . 169 parts In-Stock

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$58.051

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169

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Argo Parts USA

USA . 3,100 parts In-Stock

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Corphita

USA . 2,541 parts In-Stock

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DigiPath Technology Company

USA . 1,775 parts In-Stock

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$42.197

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$42.197

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Continental Prestige Electronics

USA . 589 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Discover the power and precision of the Texas Instruments MSC1202Y3RHHTG4 microcontroller. With a reputation for excellence, Texas Instruments delivers top-quality products that exceed expectations. This microcontroller offers endless possibilities in various applications, from automotive to industrial settings. Experience the seamless integration, reliability, and efficiency this product brings to your projects. Unlock new opportunities and elevate your designs with the MSC1202Y3RHHTG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, optimizing space and reducing manufacturing costs.

Maximum Supply Voltage: 5.25 V

Supports a wide range of power supply voltages, making it versatile for different power requirements.

Bit Size: 8

An 8-bit architecture offers a good balance between processing power and cost-effectiveness for many embedded applications.

DAC Channels: YES

Integrated DAC channels enable the microcontroller to output analog signals, expanding its functionality for sensor interfacing and control applications.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, providing flexibility for design compatibility with various systems.

No. of Terminals: 36

Having a large number of terminals allows for more I/O connections and peripheral interfacing, enhancing the microcontroller's capabilities.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures reliable operation even under varying power conditions, improving system stability.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, the microcontroller can withstand harsh environmental conditions, making it suitable for industrial and automotive applications.

CPU Family: 8051

Belonging to the 8051 CPU family ensures compatibility with existing software tools and resources, simplifying development and programming tasks.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to operate in extreme cold conditions without performance degradation, ideal for outdoor and automotive installations.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to convert analog signals to digital data, essential for sensor data acquisition and processing tasks.

ROM Words: 8192

With a large ROM capacity, the microcontroller can store a significant amount of program code and data, supporting complex algorithms and functions.

Maximum Clock Frequency: 33 MHz

A high clock frequency allows for fast processing speeds, enabling real-time control and high-performance computing tasks.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and features in a single chip, reducing external component count and board space requirements.

RAM Bytes: 128

Having sufficient RAM capacity enables the microcontroller to store and manipulate data efficiently, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, optimizing energy efficiency and performance reliability in the microcontroller.

ROM Programmability: FLASH

Flash ROM allows for easy programmability and firmware updates, facilitating development and customization of embedded applications.

Technical Specifications

Microcontrollers MSC1202Y3RHHTG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

16

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

MSC1202Y3RHHTG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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