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MSC1200Y2PFBRG4

Texas Instruments

MSC1200Y2PFBRG4 by Texas Instruments

The Texas Instruments MSC1200Y2PFBRG4 is an 8-bit microcontroller with 256 bytes of RAM and 4096 ROM words. It operates at a max clock frequency of 33 MHz, suitable for automotive applications due to its temperature grade. With DAC and ADC channels, it offers versatile performance in a compact package style ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,950 parts In-Stock

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4,950

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Digiode

USA . 4,171 parts In-Stock

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4,171

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Distributors (Availability)

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One Stop Electronics

USA . 1,534 parts In-Stock

1+ parts

$8.000

100+ parts

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1,534

$8.000

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AZTECH Wire

Italy . 829 parts In-Stock

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$11.198

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829

$11.198

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Parana Technologies

USA . 1,657 parts In-Stock

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$40.558

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1,657

$40.558

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DigiPath Technology Company

USA . 564 parts In-Stock

1+ parts

$44.660

100+ parts

$41.087

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564

$44.660

$41.087

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IDEA Electronic Components Group

UK . 1,927 parts In-Stock

1+ parts

$45.571

100+ parts

$43.292

1k+ parts

$41.014

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1,927

$45.571

$43.292

$41.014

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ChromeModa Solutions

Germany . 1,542 parts In-Stock

1+ parts

$45.571

100+ parts

$37.368

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1,542

$45.571

$37.368

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Component Stockers USA

USA . 609 parts In-Stock

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$99.990

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609

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Microchip USA

USA . 4,008 parts In-Stock

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Corphita

USA . 2,212 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the MSC1200Y2PFBRG4 microcontroller by Texas Instruments. Designed with precision and reliability in mind, this versatile device offers unparalleled performance for a wide range of applications. Whether you're developing automotive systems or industrial automation solutions, this microcontroller delivers exceptional value and efficiency. Trust in Texas Instruments' reputation for excellence and unlock the full potential of your projects with the MSC1200Y2PFBRG4. Elevate your designs and drive innovation with this state-of-the-art microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material helps in reducing the overall weight of the microcontroller, making it suitable for lightweight and compact electronic devices.

Surface Mount: YES

Surface mount capability enables easy and efficient assembly of the microcontroller onto electronic circuit boards, saving space and making it ideal for high-density applications.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage tolerance provides flexibility in power supply design and operation, ensuring stable performance in varying voltage conditions.

Package Shape: SQUARE

Square package shape allows for efficient use of board space, contributing to compact design layouts and facilitating easier integration into electronic systems.

Bit Size: 8

8-bit processing capability offers a balance between performance and cost, suitable for a wide range of embedded applications that do not require high computational power.

DAC Channels: YES

Built-in DAC channels enable precise analog signal generation, expanding the range of applications where the microcontroller can be used for tasks such as audio processing or sensor interfacing.

Power Supplies (V): 3/5

Support for multiple power supply options (3V and 5V) allows compatibility with different voltage requirements of peripherals and systems, offering versatility in design and implementation.

No. of Terminals: 48

48 terminals provide ample connectivity for interfacing with external components and peripherals, offering flexibility in system integration and expansion capabilities.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile with fine pitch package style enhances the microcontroller's thermal performance, facilitates PCB layout, and supports high-density mounting for space-constrained applications.

Minimum Supply Voltage: 4.75 V

With a low minimum supply voltage requirement, the microcontroller can operate efficiently even with lower power sources, making it suitable for battery-powered devices and energy-efficient designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments and industrial applications where temperature fluctuations are common, enhancing the overall robustness of the microcontroller.

CPU Family: 8051

Belonging to the 8051 CPU family, this microcontroller offers familiarity and compatibility with a well-established architecture, making it easier for developers to work with existing software libraries and tools.

Minimum Operating Temperature: -40 °C

Operating at a low minimum temperature allows the microcontroller to function reliably in cold environments or during startup conditions, ensuring operational integrity in a wide range of temperature settings.

ADC Channels: YES

Inclusion of ADC channels enables analog-to-digital conversion, facilitating sensor data acquisition, signal processing, and measurement tasks, broadening the range of applications where the microcontroller can be utilized.

Terminal Position: QUAD

Quad terminal position offers a compact and efficient layout for connections, optimizing PCB space usage and simplifying the assembly process, making it suitable for miniaturized electronic designs.

ROM Words: 4096

4096 ROM words provide sufficient storage capacity for program code and configuration data, accommodating a range of application requirements and supporting versatile software development.

Maximum Seated Height: 1.2 mm

Low maximum seated height allows for slim and compact designs, reducing the overall profile of electronic devices and enabling space-efficient integration of the microcontroller into tight enclosures or assemblies.

Width: 7 mm

Compact width dimension facilitates efficient board layout and component placement, contributing to space-saving designs and enabling the microcontroller to be used in small-scale applications where size constraints are a consideration.

Maximum Clock Frequency: 33 MHz

High maximum clock frequency of 33 MHz allows for fast processing and execution of instructions, offering responsive performance in real-time applications and time-sensitive tasks, enhancing the microcontroller's overall speed and efficiency.

Length: 7 mm

Compact length dimension enables space-efficient placement on circuit boards, contributing to streamlined designs and allowing for flexibility in board layout and component positioning, particularly in applications with limited space availability.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets stringent temperature and reliability requirements, making it suitable for use in vehicles and automotive systems where durability and performance under challenging conditions are essential.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with integrated peripherals, this product offers a comprehensive solution for embedded system design, consolidating multiple functions into a single chip and simplifying the development process for embedded applications.

RAM Bytes: 256

With 256 bytes of RAM, the microcontroller provides sufficient memory for data storage, buffering, and temporary storage during program execution, supporting efficient operation and multitasking capabilities in embedded systems.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making the microcontroller energy-efficient, reliable, and versatile for various electronic applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process, enhances mechanical strength, and improves thermal performance during assembly, ensuring robust connections and long-term reliability in electronic systems.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V provides compatibility with standard power sources and ensures stable performance in typical operating conditions, making the microcontroller widely applicable in various electronic devices and systems.

ROM Programmability: FLASH

Programmable ROM in flash memory technology allows for flexible firmware updates, convenient debugging, and efficient development cycles, enabling rapid prototyping and customization of embedded applications using the microcontroller.

Terminal Pitch: 0.5 mm

Compact terminal pitch of 0.5mm optimizes PCB space utilization, enabling high-density mounting, precise connections, and efficient routing of signals, enhancing the microcontroller's integration capabilities in miniaturized electronic designs.

Speed: 33 rpm

Operating at a speed of 33 revolutions per minute (rpm) indicates the microcontroller's processing capability, offering quick execution of instructions, high data throughput, and responsive performance in real-time applications and time-critical tasks.

No. of I/O Lines: 16

16 I/O lines provide versatile input/output capabilities for interfacing with external devices, sensors, and peripherals, enabling flexible control and communication functionalities in embedded systems and electronic applications.

Technical Specifications

Microcontrollers MSC1200Y2PFBRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

16

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSC1200Y2PFBRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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