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MSC1202Y3RHHRG4

Texas Instruments

MSC1202Y3RHHRG4 by Texas Instruments

The Texas Instruments MSC1202Y3RHHRG4 is an 8-bit microcontroller with DAC and ADC channels, suitable for automotive applications. Operating at a max frequency of 33 MHz, it features 128 bytes of RAM and 8192 ROM words. With a supply voltage range of 4.75V to 5.25V, this CMOS technology chip carrier has a compact square shape measuring 6mm x 6mm.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 4,870 parts In-Stock

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Digiode

USA . 4,639 parts In-Stock

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Vyrian

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Nova Conductors

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One Stop Electronics

USA . 1,514 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 715 parts In-Stock

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$10.031

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Ampacity Inc.

Singapore . 486 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Parana Technologies

USA . 226 parts In-Stock

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$47.005

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ChromeModa Solutions

Germany . 6,032 parts In-Stock

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$52.815

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$43.308

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IDEA Electronic Components Group

UK . 1,854 parts In-Stock

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$50.174

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A-Z Elektronik GmbH

Germany . 7,283 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Aranea Global

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Argo Parts USA

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DigiPath Technology Company

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Overview

Unlock the power of innovation with the MSC1202Y3RHHRG4 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller offers customers exceptional value and benefits. With its advanced features and capabilities, the MSC1202Y3RHHRG4 provides users with a competitive edge in their projects. Experience the advantages of Texas Instruments technology and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to physical damage.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: SQUARE

Square-shaped package ensures easy handling and placement on a circuit board.

Bit Size: 8

8-bit processing capability allows for efficient performance of tasks and operations.

DAC Channels: YES

DAC channels enable the microcontroller to convert digital signals into analog outputs, expanding its functionality.

Power Supplies (V): 3/5

Supports multiple power supply options, allowing for versatile usage in different applications.

No. of Terminals: 36

Ample number of terminals provide connectivity options for peripherals and external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer compatibility with different system designs and thermal management requirements.

Minimum Supply Voltage: 4.75 V

Can operate effectively at lower voltage levels, conserving power and improving efficiency.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for industrial and automotive applications.

CPU Family: 8051

Based on a popular and well-established CPU architecture, ensuring reliable performance and widespread support.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperature environments, making it suitable for outdoor or harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent electrical conductivity and corrosion resistance, ensuring good signal transmission and long-term reliability.

ADC Channels: YES

ADC channels allow the microcontroller to convert analog signals into digital inputs, expanding its sensing capabilities.

Terminal Position: QUAD

Quad terminal layout facilitates easier PCB routing and reduces signal interference, optimizing performance.

ROM Words: 8192

Ample ROM capacity for storing program instructions and data, suitable for a wide range of applications.

Maximum Seated Height: 1 mm

Low profile design saves space in compact electronic devices and allows for sleek product designs.

Width: 6 mm

Compact width dimension enables easy integration into tight spaces or small form factor systems.

Maximum Clock Frequency: 33 MHz

High clock frequency supports fast processing speeds and real-time operations, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during soldering processes, ensuring proper assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance allows for reliable soldering and assembly in manufacturing processes.

Length: 6 mm

Compact length dimension for space-saving placement on PCBs and compatibility with various board layouts.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive applications with wide temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller IC, offering integrated processing, memory, and I/O capabilities for efficient system control.

RAM Bytes: 128

Sufficient RAM capacity for temporary data storage and processing, supporting multitasking and complex algorithms.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation for energy-efficient designs.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safe handling during manufacturing and disposal.

Nominal Supply Voltage: 5 V

Stable and standard nominal supply voltage for compatibility with common power sources and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick programming of firmware, enabling flexibility in updating software.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density PCB layouts and enables precise soldering for reliable connections.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Speed: 33 rpm

High processing speed at 33 revolutions per minute, ensuring rapid data processing and system responsiveness.

No. of I/O Lines: 16

Adequate number of I/O lines for interfacing with external devices and peripherals, enabling versatile connectivity options.

Technical Specifications

Microcontrollers MSC1202Y3RHHRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

16

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

MSC1202Y3RHHRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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