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MSC1201Y3RHHTG4

Texas Instruments

MSC1201Y3RHHTG4 by Texas Instruments

The Texas Instruments MSC1201Y3RHHTG4 is an 8-bit microcontroller with DAC and ADC channels, suitable for automotive applications. Operating at a max frequency of 33 MHz, it features 256 bytes of RAM and 8192 ROM words. With a supply voltage range of 4.75V to 5.25V, this CMOS technology chip comes in a square package style with very thin profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,545 parts In-Stock

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Digiode

USA . 716 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 776 parts In-Stock

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$10.513

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776

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One Stop Electronics

USA . 826 parts In-Stock

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$24.000

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826

$24.000

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Parana Technologies

USA . 314 parts In-Stock

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$27.742

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$39.439

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314

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$39.439

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DigiPath Technology Company

USA . 1,932 parts In-Stock

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$30.548

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$28.104

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1,932

$30.548

$28.104

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ChromeModa Solutions

Germany . 6,314 parts In-Stock

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$31.171

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$25.560

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$31.171

$25.560

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IDEA Electronic Components Group

UK . 590 parts In-Stock

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$31.171

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$29.612

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$28.054

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590

$31.171

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$28.054

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Ampacity Inc.

Singapore . 871 parts In-Stock

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$35.000

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Continental Prestige Electronics

USA . 5,399 parts In-Stock

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Corphita

USA . 3,842 parts In-Stock

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Argo Parts USA

USA . 766 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Experience the cutting-edge technology of the MSC1201Y3RHHTG4 microcontroller by Texas Instruments, a leading manufacturer in the industry known for its top-quality products. This versatile chip offers a wide range of applications in automotive and industrial settings, providing customers with reliable performance and efficient operation. With features like DAC and ADC channels, ROM programmability, and a maximum clock frequency of 33 MHz, this microcontroller delivers exceptional value and benefits to users looking for high-speed processing and precision control. Upgrade your system with the MSC1201Y3RHHTG4 and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for compact and portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.25 V

Supports a high maximum supply voltage, providing flexibility in power source options for various applications.

Package Shape: SQUARE

Square package shape aids in efficient use of board space, especially in compact designs.

Bit Size: 8

8-bit architecture offers a good balance between cost and performance for many embedded systems.

DAC Channels: YES

Presence of DAC channels allows for accurate analog output generation, crucial in many control and monitoring applications.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies enables compatibility with a wide range of peripheral components and interfaces.

No. of Terminals: 36

Sufficient number of terminals for interfacing with various external devices and peripherals, enhancing the product's versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in design and thermal management, catering to different application requirements.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage ensures efficient operation even with limited power sources, making the product suitable for battery-powered applications.

Technical Specifications

Microcontrollers MSC1201Y3RHHTG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

16

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

MSC1201Y3RHHTG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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