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MSC1201Y3RHHR

Texas Instruments

MSC1201Y3RHHR by Texas Instruments

MSC1201Y3RHHR by Texas Instruments is an 8-bit microcontroller with a max clock frequency of 33 MHz. It has ADC and DAC channels, making it suitable for automotive applications. Its compact size (6mm x 6mm) and low profile (1mm) make it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,775 parts In-Stock

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Digiode

USA . 1,169 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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One Stop Electronics

USA . 1,152 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 759 parts In-Stock

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$5.356

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759

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Ampacity Inc.

Singapore . 439 parts In-Stock

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$21.000

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439

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Parana Technologies

USA . 548 parts In-Stock

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$26.846

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$29.249

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548

$26.846

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$29.249

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ChromeModa Solutions

Germany . 1,849 parts In-Stock

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$30.164

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$24.734

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$30.164

$24.734

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IDEA Electronic Components Group

UK . 1,151 parts In-Stock

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$30.164

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$28.656

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$27.148

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$28.656

$27.148

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A-Z Elektronik GmbH

Germany . 4,629 parts In-Stock

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Continental Prestige Electronics

USA . 4,300 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,984 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,342 parts In-Stock

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DigiPath Technology Company

USA . 199 parts In-Stock

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Microchip USA

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Overview

Discover the MSC1201Y3RHHR by Texas Instruments, a top-quality microcontroller that offers exceptional value and benefits to customers. Manufactured by Texas Instruments, a renowned leader in the industry, this microcontroller is perfect for a range of applications. With its advanced technology and high-performance features, it delivers reliable and efficient results. Whether you are working on automotive projects or need a microcontroller for general purposes, the MSC1201Y3RHHR is the ideal choice. Its compact size, wide operating temperature range, and low power consumption make it the go-to option for professionals and enthusiasts alike. Upgrade your projects with the MSC1201Y3RHHR and experience unmatched performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice.

Surface Mount: YES

The surface mount feature allows for easy assembly and integration, simplifying the manufacturing process.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, enhancing versatility.

Package Shape: SQUARE

The square shape facilitates efficient space utilization, making it suitable for applications with limited available area.

Bit Size: 8

The 8-bit architecture allows for efficient processing and memory utilization, making it suitable for a variety of applications.

DAC Channels: YES

The presence of DAC (Digital-to-Analog Converter) channels enables the microcontroller to interface with analog systems seamlessly.

Power Supplies (V): 3/5

With support for both 3V and 5V power supplies, this microcontroller can adapt to various voltage requirements, expanding its range of applications.

No. of Terminals: 36

The abundance of terminals allows for easy connectivity, accommodating the connection of multiple devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style provides excellent heat dissipation and a compact profile, ensuring reliability and efficient use of space.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage provides flexibility in power sources while maintaining stable operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand demanding environments, increasing its reliability.

CPU Family: 8051

The 8051 CPU family is widely recognized and supported, offering a vast ecosystem of resources and development tools.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate reliably at very low temperatures makes it suitable for a wide range of environments.

ADC Channels: YES

The presence of ADC (Analog-to-Digital Converter) channels allows for seamless integration with analog sensors and signals.

Terminal Position: QUAD

The quad terminal position provides flexibility in PCB layout and eases the connection of peripheral devices.

ROM Words: 8192

The generous ROM capacity of 8192 words enables the storage of complex program code, meeting the requirements of sophisticated applications.

Maximum Seated Height: 1 mm

The low seated height allows for the microcontroller to be integrated into compact, space-constrained designs.

Width: 6 mm

The narrow width of 6 mm facilitates the integration of this microcontroller into space-limited applications.

Maximum Clock Frequency: 33 MHz

With a high clock frequency, this microcontroller can execute instructions quickly, resulting in high overall system performance.

Length: 6 mm

The compact length of 6 mm makes this microcontroller suitable for small form factor designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation even in harsh automotive environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product incorporates various peripherals, making it a versatile solution for a wide range of applications.

RAM Bytes: 128

The ample RAM capacity of 128 bytes allows for efficient data storage and manipulation during program execution.

Technology: CMOS

The CMOS technology used in this microcontroller provides low power consumption, making it energy-efficient and suitable for battery-powered applications.

Terminal Form: NO LEAD

The no-lead terminal form enhances reliability and simplifies the soldering process during assembly.

Nominal Supply Voltage: 5 V

The microcontroller's nominal supply voltage of 5V is a common standard in many electronic systems, ensuring compatibility and ease of integration.

ROM Programmability: FLASH

The flash memory-based programmability allows for easy and flexible firmware updates, enabling rapid prototyping and product iteration.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm accommodates high-density PCB designs, enabling compact and space-efficient electronic systems.

Speed: 33 rpm

With a speed of 33 rpm, this microcontroller can perform computations and data processing tasks quickly and efficiently.

No. of I/O Lines: 16

The 16 I/O lines provide ample connectivity options, allowing for the connection of various peripherals and external devices.

Technical Specifications

Microcontrollers MSC1201Y3RHHR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N36

Length:

6 mm

No. of I/O Lines:

16

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Trade Compliance

MSC1201Y3RHHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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