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LM96550SQX

Texas Instruments

LM96550SQX by Texas Instruments

Texas Instruments' LM96550SQX is a 80-terminal CMOS telecom IC with 10V supply voltage. Operating b/w 0-70°C, it comes in a square chip carrier package style with 0.5mm terminal pitch. Ideal for telecom circuits, this IC has a very thin profile and no-lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,496 parts In-Stock

1+ parts

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3,496

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Digiode

USA . 2,873 parts In-Stock

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2,873

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Anansix

USA . 134 parts In-Stock

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134

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Distributors (Availability)

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Parana Technologies

USA . 1,178 parts In-Stock

1+ parts

$8.090

100+ parts

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1k+ parts

$8.678

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1,178

$8.090

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$8.678

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DigiPath Technology Company

USA . 2,161 parts In-Stock

1+ parts

$8.908

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2,161

$8.908

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ChromeModa Solutions

Germany . 5,078 parts In-Stock

1+ parts

$9.090

100+ parts

$7.454

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5,078

$9.090

$7.454

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IDEA Electronic Components Group

UK . 350 parts In-Stock

1+ parts

$9.090

100+ parts

$8.636

1k+ parts

$8.181

10k+ parts

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350

$9.090

$8.636

$8.181

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AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$18.843

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693

$18.843

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One Stop Electronics

USA . 616 parts In-Stock

1+ parts

$96.000

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616

$96.000

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Corphita

USA . 4,615 parts In-Stock

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4,615

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Overview

Unleash the power of seamless communication with the Texas Instruments LM96550SQX. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability, designed to elevate your connectivity experience. With a wide range of applications in various industries, this product delivers exceptional value and benefits to customers seeking top-notch performance. Say goodbye to connectivity issues and embrace the future of seamless communication with the LM96550SQX by Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on PCBs, making it suitable for compact electronic devices.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during assembly, ensuring a more stable and reliable connection.

No. of Terminals: 80

With a high number of terminals, this product offers versatile connectivity options for various telecom applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature provides reliability and stability in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality in a wide range of operating conditions.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers thermal management and space efficiency, ideal for telecom devices with limited space.

Terminal Position: QUAD

Quad terminal position allows for efficient signal transmission and connectivity, contributing to improved performance.

Maximum Seated Height: 0.8 mm

Low maximum seated height enables a compact design, suitable for slim and portable electronic devices.

Width: 12 mm

The moderate width provides a balance between space-saving and ease of handling during assembly.

Length: 12 mm

The moderate length offers a compact form factor, making it suitable for applications where space is a constraint.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it efficient for telecom interface applications.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and offers environmental sustainability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuit applications, offering optimized performance and compatibility in telecommunications devices.

Nominal Supply Voltage: 10 V

Nominal supply voltage of 10V provides a standard voltage level for reliable operation in telecom systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for dense packing and high connectivity, ideal for telecom interface ICs.

Technical Specifications

Other Function Telecom Interface ICs LM96550SQX attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

10 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

LM96550SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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