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LM96570SQE

Texas Instruments

LM96570SQE by Texas Instruments

Texas Instruments' LM96570SQE is a 32-terminal telecom IC with 1.8V supply voltage, operating from 0 to 70°C. Its square chip carrier package has a very thin profile at 0.8mm height, suitable for telecom circuit applications. With surface mount capability and quad terminal position, it offers high performance in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,842 parts In-Stock

1+ parts

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8,842

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Digiode

USA . 4,286 parts In-Stock

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4,286

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Anansix

USA . 1,404 parts In-Stock

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1,404

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 700 parts In-Stock

1+ parts

$9.116

100+ parts

$846.584

1k+ parts

$8.205

10k+ parts

-

700

$9.116

$846.584

$8.205

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DigiPath Technology Company

USA . 896 parts In-Stock

1+ parts

$10.038

100+ parts

-

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896

$10.038

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ChromeModa Solutions

Germany . 4,885 parts In-Stock

1+ parts

$10.243

100+ parts

$8.399

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-

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4,885

$10.243

$8.399

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IDEA Electronic Components Group

UK . 1,488 parts In-Stock

1+ parts

$10.243

100+ parts

$9.731

1k+ parts

$9.219

10k+ parts

-

1,488

$10.243

$9.731

$9.219

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AZTECH Wire

Italy . 308 parts In-Stock

1+ parts

$12.534

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308

$12.534

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One Stop Electronics

USA . 448 parts In-Stock

1+ parts

$641.000

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448

$641.000

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Corphita

USA . 2,141 parts In-Stock

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2,141

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the LM96570SQE, a cutting-edge telecom interface IC designed for a wide range of applications. With its surface mount technology and compact square package shape, this chip carrier offers superior performance in a variety of telecom circuits. From its very thin profile to its commercial-grade temperature grade, the LM96570SQE ensures optimal functionality in any environment. Trust in Texas Instruments to deliver exceptional value and innovation with the LM96570SQE, setting new standards in the industry.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto PCBs, saving time and simplifying the manufacturing process.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during assembly and installation.

No. of Terminals: 32

Offers a sufficient number of terminals for connecting various components and interfaces, increasing the product's versatility.

Maximum Operating Temperature: 70 °C

With a high operating temperature range, the product can function reliably in a variety of environmental conditions.

Minimum Operating Temperature: 0 °C

Suitable for use in both cold and warm environments, ensuring consistent performance regardless of temperature.

Terminal Position: QUAD

Quad terminal position allows for efficient connection and signal transmission, enhancing overall performance.

Width: 5 mm

Compact width makes the product suitable for applications with space constraints, enabling versatile use in various devices.

Length: 5 mm

Compact length ensures the product can fit into tight spaces, making it ideal for compact electronic designs.

Nominal Supply Voltage: 1.8 V

Low supply voltage requirement helps in reducing power consumption, making the product energy-efficient.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling space-saving design and compact PCB layouts.

Technical Specifications

Other Function Telecom Interface ICs LM96570SQE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

LM96570SQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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