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LM96550SQE

Texas Instruments

LM96550SQE by Texas Instruments

Texas Instruments' LM96550SQE is a 80-terminal telecom IC with CMOS technology. Operating b/w 0-70°C, it has a nominal voltage of 10V. This square-shaped chip carrier is ideal for telecom circuit applications due to its very thin profile and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,800 parts In-Stock

1+ parts

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5,800

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Digiode

USA . 2,872 parts In-Stock

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2,872

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Anansix

USA . 589 parts In-Stock

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589

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Distributors (Availability)

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AZTECH Wire

Italy . 811 parts In-Stock

1+ parts

$8.556

100+ parts

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811

$8.556

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Parana Technologies

USA . 307 parts In-Stock

1+ parts

$10.990

100+ parts

-

1k+ parts

$11.451

10k+ parts

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307

$10.990

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$11.451

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DigiPath Technology Company

USA . 1,460 parts In-Stock

1+ parts

$12.101

100+ parts

$11.133

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1,460

$12.101

$11.133

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ChromeModa Solutions

Germany . 3,321 parts In-Stock

1+ parts

$12.348

100+ parts

$10.125

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3,321

$12.348

$10.125

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IDEA Electronic Components Group

UK . 60 parts In-Stock

1+ parts

$12.348

100+ parts

$11.731

1k+ parts

$11.113

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60

$12.348

$11.731

$11.113

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One Stop Electronics

USA . 1,520 parts In-Stock

1+ parts

$352.000

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1,520

$352.000

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Corphita

USA . 4,322 parts In-Stock

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4,322

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Lixinc

USA . 2,260 parts In-Stock

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2,260

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Overview

Unleash the power of cutting-edge technology with the LM96550SQE by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. The LM96550SQE falls into the category of Other Function Telecom Interface ICs, making it versatile for a range of applications. This product offers unparalleled value and benefits to customers, providing reliability, efficiency, and performance like no other. Experience the advantages of Texas Instruments with the LM96550SQE today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and secure installation on printed circuit boards, simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape helps in maximizing space utilization on the PCB, contributing to efficient design layouts.

No. of Terminals: 80

With a high number of terminals, this IC can support complex telecom interface functions and connectivity requirements.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable operation even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance in a wide range of operating environments.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides thermal efficiency and space-saving benefits.

Terminal Position: QUAD

The quad terminal position helps in easy and efficient soldering, ensuring secure connections on the PCB.

Maximum Seated Height: 0.8 mm

The low maximum seated height contributes to a compact design and facilitates integration into tight spaces.

Width: 12 mm

The moderate width enables proper spatial distribution on the PCB while maintaining a compact form factor.

Length: 12 mm

The moderate length allows for balanced placement on the PCB, optimizing routing and signal integrity.

Temperature Grade: COMMERCIAL

The commercial temperature grade is suitable for standard operating environments, making this IC a versatile choice for telecom applications.

Technology: CMOS

The CMOS technology offers high integration, low power consumption, and reliable performance, making it ideal for telecom interface applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process, reduces lead-related issues, and enhances the reliability of the product.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this IC offers optimized performance and functionality for telecommunication applications.

Nominal Supply Voltage: 10 V

The nominal supply voltage of 10V is commonly used in telecom systems, ensuring compatibility and reliable operation.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density and fine-pitch connections on the PCB, enhancing design flexibility and performance.

Technical Specifications

Other Function Telecom Interface ICs LM96550SQE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

10 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

LM96550SQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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