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LM96530SQ

Texas Instruments

LM96530SQ by Texas Instruments

LM96530SQ by Texas Instruments is a telecom IC with 60 terminals in a square chip carrier package. Operating temperature range of 0-70°C, supply voltage of +5V/-5V, and terminal pitch of 0.5mm make it ideal for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,004 parts In-Stock

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6,004

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Digiode

USA . 3,069 parts In-Stock

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3,069

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Anansix

USA . 2,345 parts In-Stock

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2,345

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,175 parts In-Stock

1+ parts

$16.014

100+ parts

-

1k+ parts

$16.357

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2,175

$16.014

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$16.357

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DigiPath Technology Company

USA . 527 parts In-Stock

1+ parts

$17.633

100+ parts

$16.222

1k+ parts

-

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527

$17.633

$16.222

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ChromeModa Solutions

Germany . 5,616 parts In-Stock

1+ parts

$17.993

100+ parts

$14.754

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5,616

$17.993

$14.754

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IDEA Electronic Components Group

UK . 1,415 parts In-Stock

1+ parts

$17.993

100+ parts

$17.093

1k+ parts

$16.194

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1,415

$17.993

$17.093

$16.194

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AZTECH Wire

Italy . 814 parts In-Stock

1+ parts

$19.026

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814

$19.026

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One Stop Electronics

USA . 1,093 parts In-Stock

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$806.000

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1,093

$806.000

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Corphita

USA . 1,789 parts In-Stock

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1,789

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance your telecommunications systems with the LM96530SQ by Texas Instruments. This high-quality telecom interface IC offers unmatched reliability and performance, thanks to the reputable manufacturer's expertise. Ideal for a variety of applications in the telecom industry, this square-shaped chip carrier boasts a very thin profile and 60 terminals for seamless integration. With a commercial temperature grade and nominal supply voltage of 5V, this innovative product delivers exceptional value, benefits, and advantages to customers seeking cutting-edge solutions for their communication needs. Elevate your systems with the LM96530SQ today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

The square package shape maximizes space efficiency on the board, allowing for a compact design.

No. of Terminals: 60

Having 60 terminals provides versatility in connectivity options, allowing for multiple input and output connections.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without performance degradation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a commonly used standard in many electronic devices, making compatibility easy.

Technical Specifications

Other Function Telecom Interface ICs LM96530SQ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N60

Length:

9 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

60

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

LM96530SQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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