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LM96550SQX/NOPB

Texas Instruments

LM96550SQX/NOPB by Texas Instruments

LM96550SQX/NOPB by Texas Instruments is a 80-terminal CMOS telecom IC with -10V to 10V supply voltage range. It operates b/w 0-70°C, featuring matte tin finish and quad terminal position. Ideal for telecom circuits, this chip carrier has a very thin profile and measures 12mm x 12mm in size.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,891 parts In-Stock

1+ parts

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3,891

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Digiode

USA . 3,287 parts In-Stock

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3,287

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 833 parts In-Stock

1+ parts

$9.260

100+ parts

-

1k+ parts

$9.896

10k+ parts

-

833

$9.260

-

$9.896

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ChromeModa Solutions

Germany . 4,886 parts In-Stock

1+ parts

$10.405

100+ parts

$8.532

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4,886

$10.405

$8.532

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IDEA Electronic Components Group

UK . 852 parts In-Stock

1+ parts

$10.405

100+ parts

$9.885

1k+ parts

$9.364

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852

$10.405

$9.885

$9.364

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AZTECH Wire

Italy . 241 parts In-Stock

1+ parts

$16.050

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241

$16.050

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Microchip USA

USA . 3,837 parts In-Stock

1+ parts

$63.620

100+ parts

$62.510

1k+ parts

$61.960

10k+ parts

$61.410

3,837

$63.620

$62.510

$61.960

$61.410

Component Stockers USA

USA . 325 parts In-Stock

1+ parts

$99.990

100+ parts

-

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325

$99.990

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One Stop Electronics

USA . 752 parts In-Stock

1+ parts

$648.000

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752

$648.000

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QUARKTWIN TECHNOLOGY LTD

USA . 23,605 parts In-Stock

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23,605

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DigiPath Technology Company

USA . 1,525 parts In-Stock

1+ parts

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100+ parts

$9.381

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1,525

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$9.381

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Corphita

USA . 404 parts In-Stock

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404

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Overview

Elevate your telecom interface designs with the LM96550SQX/NOPB by Texas Instruments, offering unmatched quality and reliability. This square package chip carrier IC boasts a very thin profile, making it ideal for space-constrained applications. With a nominal supply voltage of 10V and commercial-grade temperature rating, this Telecom Circuit IC delivers exceptional performance in a compact form factor. Trust in Texas Instruments' expertise to bring innovation to your projects and elevate your designs to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy assembly and placement on circuit boards, making the product suitable for high-volume manufacturing.

Package Shape: SQUARE

The square package shape provides a compact and space-efficient design, ideal for applications where board space is limited.

No. of Terminals: 80

With a high number of terminals, the product offers versatility in connectivity and functionality, catering to complex telecom interface requirements.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand demanding operating conditions without performance degradation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the telecom interface ICs.

Technical Specifications

Other Function Telecom Interface ICs LM96550SQX/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-10 V

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

10 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

LM96550SQX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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