Loading...

LM96551SQE

Texas Instruments

LM96551SQE by Texas Instruments

Texas Instruments LM96551SQE is a 80-terminal CMOS telecom IC with 3.3V supply voltage. It operates b/w 0-70°C, in a square chip carrier package style. Ideal for telecom circuits, it features a 0.5mm terminal pitch and 0.8mm seated height for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,077

-

-

-

-

Digiode

USA . 4,279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,279

-

-

-

-

Anansix

USA . 1,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,182

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 602 parts In-Stock

1+ parts

$12.853

100+ parts

-

1k+ parts

-

10k+ parts

-

602

$12.853

-

-

-

Parana Technologies

USA . 903 parts In-Stock

1+ parts

$13.373

100+ parts

-

1k+ parts

$13.891

10k+ parts

-

903

$13.373

-

$13.891

-

DigiPath Technology Company

USA . 849 parts In-Stock

1+ parts

$14.725

100+ parts

-

1k+ parts

-

10k+ parts

-

849

$14.725

-

-

-

ChromeModa Solutions

Germany . 2,250 parts In-Stock

1+ parts

$15.026

100+ parts

$12.321

1k+ parts

-

10k+ parts

-

2,250

$15.026

$12.321

-

-

IDEA Electronic Components Group

UK . 470 parts In-Stock

1+ parts

$15.026

100+ parts

$14.275

1k+ parts

$13.523

10k+ parts

-

470

$15.026

$14.275

$13.523

-

One Stop Electronics

USA . 1,246 parts In-Stock

1+ parts

$523.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,246

$523.000

-

-

-

Corphita

USA . 5,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,247

-

-

-

-

Overview

Elevate your telecom interface applications with the LM96551SQE by Texas Instruments. This cutting-edge IC boasts top-notch quality and reliability, thanks to its renowned manufacturer. With a sleek square package shape and 80 terminals, this chip carrier offers unparalleled performance and versatility. Whether you're in need of a telecom circuit or other function interface, the LM96551SQE delivers exceptional value and benefits. Trust Texas Instruments to provide the innovation and technology you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making this product suitable for high-volume manufacturing processes.

Package Shape: SQUARE

The square package shape helps in saving space on the circuit board and ensures efficient use of available area.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This multi-feature package style provides thermal management through heat sink/slug, protection for the chip carrier, and a compact profile for space-constrained applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding operating conditions without any performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in colder environments.

Terminal Position: QUAD

Quad terminal position enables efficient connection to other components on the circuit board, enhancing signal integrity and reliability.

Maximum Seated Height: 0.8 mm

The low seated height allows for a slim design of the overall system, making it suitable for applications where space is a constraint.

Width: 12 mm

The compact width of 12mm contributes to the overall space-saving design of the product.

Length: 12 mm

The length of 12mm ensures a balanced form factor for the product, suitable for various applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades, this product is suitable for a wide range of applications in normal operating conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various voltage levels, making this product energy-efficient and versatile.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and enhances the reliability of connections, ensuring a robust performance.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this product offers optimized performance and features for telecommunications circuit implementations.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this product is compatible with standard power sources in many telecom and electronic systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on the circuit board, enabling compact and efficient system designs.

Technical Specifications

Other Function Telecom Interface ICs LM96551SQE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

LM96551SQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20