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LM96530SQX

Texas Instruments

LM96530SQX by Texas Instruments

Texas Instruments LM96530SQX is a 60-terminal telecom IC with -5V negative supply voltage and 5V nominal voltage. Operating b/w 0-70°C, it features a square chip carrier package style at 0.8mm seated height. Ideal for telecom circuits, this IC has a quad terminal position and 0.5mm pitch for various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,413 parts In-Stock

1+ parts

-

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3,413

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Digiode

USA . 2,958 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,958

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Anansix

USA . 1,738 parts In-Stock

1+ parts

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1,738

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 288 parts In-Stock

1+ parts

$10.465

100+ parts

-

1k+ parts

$10.978

10k+ parts

-

288

$10.465

-

$10.978

-

DigiPath Technology Company

USA . 463 parts In-Stock

1+ parts

$11.523

100+ parts

$10.601

1k+ parts

-

10k+ parts

-

463

$11.523

$10.601

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-

ChromeModa Solutions

Germany . 2,313 parts In-Stock

1+ parts

$11.758

100+ parts

$9.642

1k+ parts

-

10k+ parts

-

2,313

$11.758

$9.642

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IDEA Electronic Components Group

UK . 240 parts In-Stock

1+ parts

$11.758

100+ parts

$11.170

1k+ parts

$10.582

10k+ parts

-

240

$11.758

$11.170

$10.582

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AZTECH Wire

Italy . 877 parts In-Stock

1+ parts

$15.849

100+ parts

-

1k+ parts

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10k+ parts

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877

$15.849

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One Stop Electronics

USA . 1,043 parts In-Stock

1+ parts

$367.000

100+ parts

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1,043

$367.000

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Corphita

USA . 1,304 parts In-Stock

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1,304

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Overview

Unlock the power of seamless communication with the LM96530SQX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that redefine excellence. This telecom interface IC is designed for optimal performance and reliability, making it ideal for a wide range of applications. Experience the value and benefits of this product as it enhances connectivity and efficiency like never before. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and reducing assembly costs.

Package Shape: SQUARE

The square package shape is commonly used for telecom interface ICs, providing a compact and efficient design.

No. of Terminals: 60

Having 60 terminals allows for multiple connections within the device, enabling complex telecom functions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding telecom environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the device can function in various temperature conditions.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection for the IC within the circuit.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a slim profile design, ideal for space-constrained telecom applications.

Width: 9 mm

The compact width of 9 mm enables easy placement and accommodation within telecom equipment.

Length: 9 mm

The length of 9 mm ensures a square form factor, contributing to a symmetrical layout for efficient PCB design.

Temperature Grade: COMMERCIAL

Commercial temperature grade implies the IC is suitable for typical telecom operating conditions, making it a cost-effective choice.

Nominal Negative Supply Voltage: -5 V

The nominal negative supply voltage of -5V allows for proper functioning of specific components within the telecom interface IC.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type ensures reliable and efficient performance in telecommunications systems.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is compatible with standard power sources in telecom equipment, ensuring seamless integration.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density connections, enabling intricate telecom functionality within a compact form factor.

Technical Specifications

Other Function Telecom Interface ICs LM96530SQX attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N60

Length:

9 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

60

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

LM96530SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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