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LM96551SQX

Texas Instruments

LM96551SQX by Texas Instruments

Texas Instruments' LM96551SQX is a 80-terminal telecom IC with CMOS technology. Operating b/w 0-70°C, it has a nominal voltage of 3.3V and terminal pitch of 0.5mm. Ideal for telecom circuits, this chip carrier is surface mountable and features a very thin profile package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,415 parts In-Stock

1+ parts

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6,415

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Digiode

USA . 4,462 parts In-Stock

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4,462

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Anansix

USA . 1,879 parts In-Stock

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1,879

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,407 parts In-Stock

1+ parts

$6.040

100+ parts

-

1k+ parts

$6.817

10k+ parts

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1,407

$6.040

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$6.817

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DigiPath Technology Company

USA . 1,072 parts In-Stock

1+ parts

$6.650

100+ parts

$6.118

1k+ parts

-

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1,072

$6.650

$6.118

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ChromeModa Solutions

Germany . 4,100 parts In-Stock

1+ parts

$6.786

100+ parts

$5.565

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-

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4,100

$6.786

$5.565

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IDEA Electronic Components Group

UK . 2,238 parts In-Stock

1+ parts

$6.786

100+ parts

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1k+ parts

$6.107

10k+ parts

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2,238

$6.786

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$6.107

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AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$15.999

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871

$15.999

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One Stop Electronics

USA . 614 parts In-Stock

1+ parts

$324.000

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614

$324.000

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Corphita

USA . 4,155 parts In-Stock

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4,155

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Overview

Unlock the power of seamless communication with the LM96551SQX from Texas Instruments. This cutting-edge telecom interface IC boasts top-notch quality and reliability, thanks to its reputable manufacturer. Perfect for a wide range of applications, this chip carrier with a very thin profile offers unparalleled value and performance. Say goodbye to connectivity issues and hello to smooth, uninterrupted communication with the LM96551SQX.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes the product easy to install on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it ideal for applications where board real estate is limited.

No. of Terminals: 80

Having 80 terminals allows for a wide range of connectivity options, making this product versatile and suitable for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and compact design, making this product ideal for space-constrained environments.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures, ensuring reliable performance in demanding conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the product can also operate in colder environments, making it versatile for various temperature conditions.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, enhancing the overall reliability of the product.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm ensures a low-profile design, making this product suitable for applications where space constraints are a concern.

Width: 12 mm

The 12 mm width provides a compact form factor, making this product suitable for applications where space is limited.

Length: 12 mm

The 12 mm length further contributes to the compact design of the product, allowing for efficient use of space on the circuit board.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this product is suitable for standard commercial applications, offering reliability and performance in typical operating conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of solder joint failure, ensuring robust connections and enhancing the overall durability of the product.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type IC, this product is specifically designed for telecommunications applications, offering specialized features and performance for such use cases.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this product is compatible with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for fine and secure connections, ensuring reliable signal transmission and minimizing the risk of electrical interference.

Technical Specifications

Other Function Telecom Interface ICs LM96551SQX attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

LM96551SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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