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LM96570SQX/NOPB

Texas Instruments

LM96570SQX/NOPB by Texas Instruments

Texas Instruments LM96570SQX/NOPB is a 32-terminal telecom IC with 1.8V supply voltage, operating from 0 to 70°C. It features a square chip carrier package style, matte tin terminal finish, and 0.5mm terminal pitch. Ideal for telecom circuits, this IC has a very thin profile at 0.8mm seated height and is surface mountable for compact applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,341 parts In-Stock

1+ parts

-

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7,341

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Anansix

USA . 2,510 parts In-Stock

1+ parts

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2,510

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Digiode

USA . 1,521 parts In-Stock

1+ parts

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1,521

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 274 parts In-Stock

1+ parts

$6.048

100+ parts

-

1k+ parts

$6.826

10k+ parts

-

274

$6.048

-

$6.826

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ChromeModa Solutions

Germany . 6,708 parts In-Stock

1+ parts

$6.796

100+ parts

$5.573

1k+ parts

-

10k+ parts

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6,708

$6.796

$5.573

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IDEA Electronic Components Group

UK . 2,003 parts In-Stock

1+ parts

$6.796

100+ parts

-

1k+ parts

$6.116

10k+ parts

-

2,003

$6.796

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$6.116

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AZTECH Wire

Italy . 428 parts In-Stock

1+ parts

$16.396

100+ parts

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428

$16.396

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Microchip USA

USA . 5,624 parts In-Stock

1+ parts

$51.080

100+ parts

$50.190

1k+ parts

$49.750

10k+ parts

$49.300

5,624

$51.080

$50.190

$49.750

$49.300

One Stop Electronics

USA . 1,646 parts In-Stock

1+ parts

$333.000

100+ parts

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1,646

$333.000

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Component Stockers USA

USA . 326 parts In-Stock

1+ parts

$348.080

100+ parts

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326

$348.080

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Corphita

USA . 4,493 parts In-Stock

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4,493

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DigiPath Technology Company

USA . 1,964 parts In-Stock

1+ parts

-

100+ parts

$6.127

1k+ parts

-

10k+ parts

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1,964

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$6.127

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the LM96570SQX/NOPB. Perfect for a wide range of applications in the telecom industry, this innovative product offers exceptional value and benefits to customers. With advanced features and cutting-edge technology, this telecom interface IC ensures seamless performance and efficiency. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Elevate your projects with the LM96570SQX/NOPB today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on printed circuit boards, saving space and simplifying assembly process.

Package Shape: SQUARE

Provides a compact and efficient form factor for the IC, making it suitable for applications where space is limited.

No. of Terminals: 32

Offers a sufficient number of connections for versatile interface options and connectivity.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in higher temperature environments, making it suitable for various applications.

Terminal Finish: MATTE TIN

Provides good solderability and ensures secure electrical connections for improved reliability.

Nominal Supply Voltage: 1.8 V

Operates at a low voltage level, offering energy efficiency and compatibility with various power sources.

Technical Specifications

Other Function Telecom Interface ICs LM96570SQX/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

LM96570SQX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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