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LM96551SQX/NOPB

Texas Instruments

LM96551SQX/NOPB by Texas Instruments

LM96551SQX/NOPB by Texas Instruments is a telecom interface IC with 80 terminals in a square chip carrier package. Operating temperature range of 0-70°C, peak reflow temp of 260°C. Ideal for telecom circuits due to its thin profile and no lead terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,603 parts In-Stock

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Vyrian

USA . 3,561 parts In-Stock

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3,561

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Distributors (Availability)

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AZTECH Wire

Italy . 753 parts In-Stock

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$5.172

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753

$5.172

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Parana Technologies

USA . 1,639 parts In-Stock

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$14.432

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$14.872

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1,639

$14.432

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$14.872

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DigiPath Technology Company

USA . 506 parts In-Stock

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$15.892

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$14.620

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506

$15.892

$14.620

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ChromeModa Solutions

Germany . 2,586 parts In-Stock

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$16.216

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$13.297

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2,586

$16.216

$13.297

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IDEA Electronic Components Group

UK . 480 parts In-Stock

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$16.216

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$15.405

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$14.594

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480

$16.216

$15.405

$14.594

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Component Stockers USA

USA . 593 parts In-Stock

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$99.990

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593

$99.990

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One Stop Electronics

USA . 579 parts In-Stock

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$422.000

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Microchip USA

USA . 2,298 parts In-Stock

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Corphita

USA . 2,291 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the LM96551SQX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch telecom interface ICs with this product being no exception. Perfect for a wide range of applications, this chip carrier with a heat sink/slug and very thin profile offers customers exceptional value and benefits. With a temperature grade of commercial and a maximum operating temperature of 70°C, this square-shaped package with 80 terminals provides the reliability and performance you need for your next project.

Feature Benefit Bullets

Surface Mount: YES

Allows for quick and easy installation onto a PCB, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape helps optimize space utilization on the PCB, making it suitable for compact designs.

No. of Terminals: 80

High number of terminals provide more connection options and flexibility for complex circuit configurations.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability and stability even under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in a wide range of temperature environments.

Terminal Position: QUAD

Quad terminal position facilitates secure and stable connections, reducing the risk of signal loss or disconnection.

Width: 12 mm

Compact width of 12 mm enables the product to fit into tight spaces or densely populated PCB layouts.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand reflow soldering processes without damage.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard operating environments, making it a versatile choice for various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting, accommodating more connections in a limited space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, allowing for safe storage and handling under typical manufacturing conditions.

Technical Specifications

Other Function Telecom Interface ICs LM96551SQX/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N80

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

LM96551SQX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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