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F28M36P63C2ZWTS

Texas Instruments

F28M36P63C2ZWTS by Texas Instruments

Texas Instruments F28M36P63C2ZWTS microcontroller features 32-bit architecture, 1.14-1.32V supply voltage range, and 12-Ch 12-Bit ADCs. Ideal for automotive applications, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, USB with low power mode and on-chip program ROM.

Median Price

$45.743

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,024 parts In-Stock

1+ parts

$34.296

100+ parts

$30.486

1k+ parts

$22.416

10k+ parts

-

2,024

$34.296

$30.486

$22.416

-

Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$57.190

100+ parts

$42.460

1k+ parts

-

10k+ parts

-

101

$57.190

$42.460

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,787 parts In-Stock

1+ parts

$32.581

100+ parts

-

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-

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3,787

$32.581

-

-

-

Chip Stock

USA . 3,393 parts In-Stock

1+ parts

-

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-

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3,393

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Vyrian

USA . 3,003 parts In-Stock

1+ parts

-

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3,003

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 271 parts In-Stock

1+ parts

$21.555

100+ parts

-

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-

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271

$21.555

-

-

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Northwest PG Solutions

USA . 614 parts In-Stock

1+ parts

$23.711

100+ parts

$21.339

1k+ parts

-

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614

$23.711

$21.339

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-

Corphita

USA . 3,586 parts In-Stock

1+ parts

$30.866

100+ parts

-

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-

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3,586

$30.866

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-

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Parana Technologies

USA . 456 parts In-Stock

1+ parts

$34.483

100+ parts

-

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-

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456

$34.483

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DigiPath Technology Company

USA . 1,762 parts In-Stock

1+ parts

$37.970

100+ parts

$34.932

1k+ parts

-

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1,762

$37.970

$34.932

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ChromeModa Solutions

Germany . 5,982 parts In-Stock

1+ parts

$38.745

100+ parts

$31.771

1k+ parts

-

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5,982

$38.745

$31.771

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IDEA Electronic Components Group

UK . 89 parts In-Stock

1+ parts

$38.745

100+ parts

$36.808

1k+ parts

$34.870

10k+ parts

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89

$38.745

$36.808

$34.870

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Component Stockers USA

USA . 3,216 parts In-Stock

1+ parts

$39.000

100+ parts

$31.590

1k+ parts

$23.730

10k+ parts

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3,216

$39.000

$31.590

$23.730

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Lixinc

USA . 17,876 parts In-Stock

1+ parts

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17,876

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Overview

Upgrade your electronic projects with the F28M36P63C2ZWTS microcontroller from Texas Instruments. With a trusted manufacturer like TI, you can be sure of top-quality performance and reliability. This versatile microcontroller is perfect for a wide range of applications, offering advanced features like multiple peripherals, low power mode, and connectivity options including CAN, Ethernet, I2C, SPI, UART, and USB. Experience the value and benefits of this cutting-edge technology, whether you're working on automotive, industrial, or consumer electronics projects. Choose the F28M36P63C2ZWTS for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of environments.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers high performance, energy efficiency, and a rich set of features for embedded applications.

ROM Words: 1048576

Large ROM size allows for storing a significant amount of program data and instructions.

RAM Words: 232

Adequate RAM capacity for temporary data storage and efficient operation of the microcontroller.

ADC Channels: YES

Analog to digital convertors enable the microcontroller to interface with a wide range of sensors and external devices.

Connectivity: CAN(2), ETHERNET, I2C(2), SPI(4), UART(5), USB

Multiple connectivity options for seamless communication with other devices and networks.

PWM Channels: YES

Pulse width modulation channels for precise control of voltage levels, suitable for motor control and other applications.

Low Power Mode: YES

Ability to operate in low power mode helps in conserving energy and extending battery life in portable devices.

Technical Specifications

Microcontrollers F28M36P63C2ZWTS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

3

No. of I/O Lines:

142

No. of Serial I/Os:

7

No. of Terminals:

289

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

237568

RAM Words:

232

ROM Words:

1048576

Maximum Seated Height:

1.4 mm

Speed:

125 rpm

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), ETHERNET, I2C(2), SPI(4), UART(5), USB"

Peripherals:

"COMPARATOR(6), DMA(32), POR, TIMER(4), WDT(2)"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

F28M36P63C2ZWTS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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