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F28M35H22B1RFPT

Texas Instruments

F28M35H22B1RFPT by Texas Instruments

Texas Instruments F28M35H22B1RFPT is a 32-bit microcontroller with 144 terminals, operating at -40 to 105 °C. Features include DAC and ADC channels, 524288 ROM words, and 139264 RAM bytes. Ideal for industrial applications requiring a max clock frequency of 20 MHz and PWM functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,343 parts In-Stock

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3,343

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Digiode

USA . 2,703 parts In-Stock

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2,703

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One Stop Electronics

USA . 1,079 parts In-Stock

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$5.000

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1,079

$5.000

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AZTECH Wire

Italy . 847 parts In-Stock

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$6.280

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847

$6.280

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Parana Technologies

USA . 1,460 parts In-Stock

1+ parts

$54.457

100+ parts

$5,057.188

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$49.012

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$54.457

$5,057.188

$49.012

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DigiPath Technology Company

USA . 1,013 parts In-Stock

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$59.964

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$59.964

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ChromeModa Solutions

Germany . 6,485 parts In-Stock

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$61.188

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$50.174

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$61.188

$50.174

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IDEA Electronic Components Group

UK . 1,218 parts In-Stock

1+ parts

$61.188

100+ parts

$58.129

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$55.069

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1,218

$61.188

$58.129

$55.069

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Corphita

USA . 3,191 parts In-Stock

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Northwest PG Solutions

USA . 747 parts In-Stock

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Native Components

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Overview

Looking for a reliable and efficient microcontroller? Look no further than the Texas Instruments F28M35H22B1RFPT! A top-notch product from a trusted manufacturer, this microcontroller offers unparalleled performance and versatility. With a wide range of applications in various industries, this product provides customers with exceptional value and benefits. Experience seamless operations and enhanced functionality with the F28M35H22B1RFPT – the perfect choice for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications while still being robust enough to withstand environmental conditions.

Surface Mount: YES

The surface mount option allows for easy and quick installation on PCBs, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

Operating within a low maximum supply voltage range can help minimize power consumption and prevent damage to the microcontroller.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB, enabling more compact designs and optimized layout.

Bit Size: 32

The 32-bit architecture provides higher processing power and capability, suitable for tasks that require complex calculations and operations.

DAC Channels: YES

With Digital-to-Analog Converter channels, the microcontroller can generate analog output signals, enabling it to interface with various analog sensors and devices.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages allows flexibility in system integration and compatibility with different power sources.

No. of Terminals: 144

Having a high number of terminals provides ample connectivity options for interfacing with peripheral devices and components within a system.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even with varying power input, improving the microcontroller's stability in different operating conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range allows the microcontroller to be used in harsh environments without risk of overheating or malfunction.

CPU Family: CORTEX-M3

The Cortex-M3 architecture provides a balance of performance and energy efficiency, making it a suitable choice for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller can function reliably in cold environments, expanding its usability across different conditions.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to convert analog signals from sensors or external devices into digital data for processing and analysis.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and routing, enhancing ease of assembly and reducing the risk of signal interference or crosstalk.

ROM Words: 524288

The large ROM capacity enables storing program instructions and data, accommodating complex software requirements and applications.

Maximum Seated Height: 1.2 mm

With a low seated height, this microcontroller can be used in space-constrained designs and compact devices without compromising performance or functionality.

Width: 20 mm

The compact width dimension allows for flexibility in PCB layout and integration, enabling the microcontroller to fit within tight spaces or small form factor designs.

Maximum Clock Frequency: 20 MHz

Operating at a high clock frequency of 20 MHz provides fast processing speed and responsiveness, making the microcontroller suitable for real-time applications and tasks.

Length: 20 mm

The compact length dimension contributes to a smaller overall footprint, facilitating integration into space-limited electronic systems or devices.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the microcontroller can withstand harsh environments, voltage fluctuations, and temperature variations commonly found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC-based architecture of the microcontroller ensures efficient and fast execution of instructions, making it suitable for high-performance embedded systems and applications.

RAM Bytes: 139264

The large RAM capacity allows for storing and accessing data during program execution, enabling smooth multitasking and efficient operation of complex algorithms or tasks.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy electrical environments.

Terminal Form: GULL WING

The Gull Wing terminal form simplifies soldering and assembly processes, ensuring secure connections and reliable electrical contact for optimal performance.

Nominal Supply Voltage: 1.2 V

Operational at a nominal supply voltage of 1.2V, the microcontroller can achieve a balance between power efficiency and performance, suitable for battery-powered devices or low-power applications.

PWM Channels: YES

Pulse Width Modulation channels enable the microcontroller to generate precise digital signals with variable duty cycles, essential for controlling motors, LEDs, and other devices with analog-like behavior.

ROM Programmability: FLASH

Flash programmability allows for easy and fast updating of firmware or software, enabling flexibility in product development and customization without the need for external programming tools.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm enables high-density mounting on PCBs, saving space and allowing for more components to be placed within a limited area for compact designs.

Speed: 100 rpm

With a speed rating of 100 rpm, the microcontroller can accurately process data and execute commands at a high rate, making it suitable for applications requiring fast response times.

No. of I/O Lines: 74

Having 74 I/O lines provides ample interfaces for connecting with external devices, sensors, and peripherals, allowing for versatile and customizable functionality in various applications.

Technical Specifications

Microcontrollers F28M35H22B1RFPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H22B1RFPT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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