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F28M36P63C2ZWTT

Texas Instruments

F28M36P63C2ZWTT by Texas Instruments

The Texas Instruments F28M36P63C2ZWTT microcontroller features a 32-bit CPU, 8KB RAM, and 12-Ch 12-Bit ADC for industrial applications. With a max supply voltage of 1.32V and operating temperature range from -40 to 105°C, it offers low power mode and connectivity options including CAN, Ethernet, I2C, SPI, UART, and USB interfaces. The package style is grid array with a low profile design suitable for various electronic systems requiring high performance in a compact form factor.

Median Price

$48.270

Lifecycle Status

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Texas Instruments

USA . 428 parts In-Stock

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$28.580

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$25.405

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$18.680

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$28.580

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Mouser Electronics

USA . 576 parts In-Stock

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$48.270

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$34.240

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$48.270

$34.240

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DigiKey

USA . 268 parts In-Stock

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$48.340

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$35.167

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$33.789

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268

$48.340

$35.167

$33.789

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Digiode

USA . 1,975 parts In-Stock

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$27.151

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$27.151

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Nova Conductors

Japan . 19 parts In-Stock

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$32.490

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Chip Stock

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Vyrian

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AZTECH Wire

Italy . 611 parts In-Stock

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$6.801

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611

$6.801

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Ampacity Inc.

Singapore . 271 parts In-Stock

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$24.290

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$24.290

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Semicontronic

India . 143 parts In-Stock

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$24.290

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$23.683

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$23.561

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$24.290

$23.683

$23.561

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Parana Technologies

USA . 1,886 parts In-Stock

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$25.481

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$26.105

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$25.481

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$26.105

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Corphita

USA . 3,792 parts In-Stock

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$25.722

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IDEA Electronic Components Group

UK . 1,989 parts In-Stock

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$28.630

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$27.198

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$25.767

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1,989

$28.630

$27.198

$25.767

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ChromeModa Solutions

Germany . 466 parts In-Stock

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$28.630

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$23.477

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$28.630

$23.477

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Continental Prestige Electronics

USA . 3,503 parts In-Stock

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$32.490

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$31.840

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$32.490

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$31.840

Corohmni

South Africa . 523 parts In-Stock

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$78.706

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QUARKTWIN TECHNOLOGY LTD

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iodParts Technologies Inc.

India . 9,080 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,146 parts In-Stock

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Argo Parts USA

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Lixinc

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Metaverse IC Inc.

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Kepictronics

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DigiPath Technology Company

USA . 1,627 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$31.840

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$30.866

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$30.216

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$31.840

$30.866

$30.216

Perfect Parts

USA . 436 parts In-Stock

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GreenTree Electronics

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Overview

Experience cutting-edge technology with the F28M36P63C2ZWTT microcontroller from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This microcontroller is versatile and efficient, offering a wide range of applications in various industries. With its advanced features and high performance capabilities, this microcontroller provides exceptional value and benefits to customers, making it the perfect choice for your next project. Trust Texas Instruments for superior innovation and excellence in microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures that the product is robust and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 1.32 V

The low maximum supply voltage helps in minimizing power consumption and ensures efficient operation of the microcontroller.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width allows for efficient data processing and storage within the microcontroller.

Address Bus Width: 28

A wide address bus width allows for addressing a larger memory space, making the microcontroller suitable for complex applications.

Package Shape: SQUARE

The square package shape provides a compact form factor and ease of mounting in various electronic systems.

Bit Size: 32

A 32-bit microcontroller offers high computational power and efficiency for handling complex tasks and computations.

No. of Terminals: 289

Having a high number of terminals allows for enhanced connectivity and interfacing with external devices and components.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high reliability, low profile design, and fine pitch for compact PCB layout and space-saving.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even at low power supply levels.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and operate reliably in industrial settings.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures optimal performance, energy efficiency, and compatibility with a wide range of software tools and libraries.

No. of External Interrupts: 3

Having multiple external interrupts allows the microcontroller to respond quickly to external events and handle multiple tasks simultaneously.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the microcontroller to function reliably in extreme cold environments without any performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER ensures high conductivity, corrosion resistance, and reliability in various operating conditions.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and convert analog signals to digital data, expanding its application capabilities.

DMA Channels: YES

Having DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention, enhancing overall system performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on PCBs, ensuring proper connectivity and stability in the system.

ROM Words: 1048576

With a large ROM capacity, the microcontroller can store a significant amount of program memory, enabling the implementation of complex algorithms and applications.

Maximum Seated Height: 1.4 mm

The low maximum seated height ensures compatibility with slim and compact device designs, offering flexibility in product integration.

RAM Words: 232

A sufficient number of RAM words allows for temporary data storage and manipulation during program execution, enhancing the microcontroller's processing capabilities.

Width: 16 mm

The compact width of 16mm enables space-saving PCB layout designs and integration into various electronic devices with limited space constraints.

Boundary Scan: YES

Boundary scan capability simplifies PCB testing and diagnostics, ensuring easy maintenance and troubleshooting of the microcontroller in the production environment.

External Data Bus Width: 32

A wide external data bus width of 32 bits allows for high-speed data transfer between the microcontroller and external devices, enhancing system performance.

Peripherals: "COMPARATOR(6), DMA(32), POR, TIMER(4), WDT(2)

The variety of peripherals, including comparators, DMA channels, timers, and watchdog timers, provide additional functionality and flexibility for a wide range of application requirements.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures proper soldering during assembly, maintaining the integrity and reliability of the microcontroller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for lead-free soldering processes, ensuring compliance with RoHS regulations and industry standards.

Length: 16 mm

The compact length of 16mm facilitates space-efficient PCB layout designs and integration into small form factor electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with extended temperature ranges and challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient instruction execution, low power consumption, and high performance for various embedded applications.

No. of Timers: 4

Having multiple timers allows for precise timing control and event scheduling, essential for applications requiring accurate time-based operations.

RAM Bytes: 237568

The large RAM capacity in bytes provides ample space for data storage and manipulation during program execution, enhancing the microcontroller's computational capabilities.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and reliable operation, making the microcontroller suitable for battery-powered and portable applications.

Terminal Form: BALL

The ball terminal form provides secure and reliable solder connections, ensuring stable electrical and mechanical performance in various operating conditions.

Analog To Digital Convertors: 12-Ch 12-Bit

The 12-channel 12-bit ADC converters enable accurate and high-resolution analog-to-digital conversions, essential for interfacing with sensor inputs and signal processing applications.

Maximum Supply Current: 40 mA

The specified maximum supply current of 40mA ensures efficient power consumption and prevents overloading the microcontroller, leading to reliable operation.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V provides stable power input for the microcontroller, ensuring consistent and reliable operation within specified voltage levels.

No. of Serial I/Os: 7

Having multiple serial I/O interfaces allows for versatile communication options with external devices, enabling data exchange and integration in diverse applications.

PWM Channels: YES

The presence of PWM channels enables precise control of analog output signals, essential for applications requiring variable speed control, power management, and signal modulation.

Connectivity: "CAN(2), ETHERNET, I2C(2), SPI(4), UART(5), USB

The diverse connectivity options, including CAN, Ethernet, I2C, SPI, UART, and USB interfaces, facilitate seamless communication and data exchange with a wide range of external devices and networks.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm enables precise soldering and compact PCB layout designs, ensuring reliable electrical connections and space-efficient integration in electronic systems.

Format: FLOATING POINT

Supporting floating-point format allows for accurate numerical calculations and complex mathematical operations, essential for applications requiring high computational precision.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate moisture sensitivity, requiring proper handling and storage to prevent moisture-related damage during assembly and use.

Technical Specifications

Microcontrollers F28M36P63C2ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

3

No. of I/O Lines:

142

No. of Serial I/Os:

7

No. of Terminals:

289

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

237568

RAM Words:

232

ROM Words:

1048576

Maximum Seated Height:

1.4 mm

Speed:

125 rpm

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), ETHERNET, I2C(2), SPI(4), UART(5), USB"

Peripherals:

"COMPARATOR(6), DMA(32), POR, TIMER(4), WDT(2)"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

F28M36P63C2ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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