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F28M35H22C1RFPQ

Texas Instruments

F28M35H22C1RFPQ by Texas Instruments

Texas Instruments F28M35H22C1RFPQ microcontroller features 32-bit CPU CORTEX-M3, 524288 ROM words, and 139264 RAM bytes. Ideal for automotive applications with AEC-Q100 screening level, operating temperature range of -40 to 125 °C, and PWM channels for precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,097 parts In-Stock

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5,097

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Digiode

USA . 4,611 parts In-Stock

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4,611

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Distributors (Availability)

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AZTECH Wire

Italy . 241 parts In-Stock

1+ parts

$8.107

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241

$8.107

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Native Components

USA . 500 parts In-Stock

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$16.340

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500

$16.340

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Northwest PG Solutions

USA . 1,800 parts In-Stock

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$17.974

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$16.177

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$17.974

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Parana Technologies

USA . 375 parts In-Stock

1+ parts

$27.602

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$37.817

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375

$27.602

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$37.817

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DigiPath Technology Company

USA . 2,053 parts In-Stock

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$30.394

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2,053

$30.394

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One Stop Electronics

USA . 793 parts In-Stock

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$31.000

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793

$31.000

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ChromeModa Solutions

Germany . 4,487 parts In-Stock

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$31.014

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$25.431

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$31.014

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IDEA Electronic Components Group

UK . 1,038 parts In-Stock

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$31.014

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$29.463

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$27.913

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1,038

$31.014

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$27.913

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Corphita

USA . 3,998 parts In-Stock

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Overview

Unlock the power of advanced technology with the F28M35H22C1RFPQ microcontroller from Texas Instruments. Built with precision and expertise, this versatile device is perfect for a wide range of applications in the automotive industry and beyond. With its high-quality materials and innovative design, this microcontroller offers unmatched performance, reliability, and efficiency. Experience seamless integration and enhanced functionality with the F28M35H22C1RFPQ, providing you with the tools you need to bring your projects to life. Upgrade your capabilities today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

Ensures safe operation within specified voltage limits to prevent damage to the microcontroller.

Screening Level: AEC-Q100

Indicates that the microcontroller meets automotive industry standards for reliability and performance.

Package Shape: SQUARE

Enables compact design and efficient use of space within electronic devices.

Bit Size: 32

Offers high processing capabilities and precision in handling data and instructions.

DAC Channels: YES

Enables analog signal generation, essential for various control and communication applications.

Power Supplies (V): 1.2,1.8,3.3

Provides flexibility in voltage requirements, allowing compatibility with different systems and components.

No. of Terminals: 144

Offers ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Provides multiple options for package styles to suit diverse installation and heat dissipation needs.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even at lower voltage levels, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

Allows the microcontroller to function in harsh environments with high temperature requirements.

CPU Family: CORTEX-M3

Utilizes a powerful and efficient processor architecture, suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in low-temperature environments, making it suitable for outdoor and industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, maintaining signal integrity and longevity of the microcontroller.

ADC Channels: YES

Enables analog-to-digital conversion for precise measurement and monitoring of external signals.

DMA Channels: YES

Facilitates efficient data transfer and processing, enhancing overall system performance and responsiveness.

Terminal Position: QUAD

Allows for easy and secure mounting on circuit boards, ensuring stable connections and signal transmission.

ROM Words: 524288

Offers ample storage capacity for program instructions and data, enabling complex applications to run smoothly.

Maximum Seated Height: 1.2 mm

Enables compact and slim device designs, ideal for space-constrained applications.

Width: 20 mm

Provides a compact form factor, suitable for integration into small electronic devices and systems.

Maximum Clock Frequency: 20 MHz

Supports high-speed data processing and execution of instructions, essential for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly during manufacturing processes, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes, ensuring reliable connections and electrical performance.

Length: 20 mm

Compact size allows for efficient placement on circuit boards and integration into various electronic systems.

Temperature Grade: AUTOMOTIVE

Designed to meet the demanding requirements of automotive applications, ensuring durability and reliability in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses a Reduced Instruction Set Computing (RISC) architecture, providing fast and efficient processing for embedded applications.

RAM Bytes: 139264

Offers ample random-access memory for data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology, known for low power consumption and high-speed operation.

Terminal Form: GULL WING

Ensures secure soldering and reliable connections on circuit boards, enhancing the durability and longevity of the microcontroller.

Nominal Supply Voltage: 1.2 V

Specifies the standard operating voltage for the microcontroller, ensuring compatibility with various power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of motor speeds, LED brightness, and other analog functions.

ROM Programmability: FLASH

Utilizes flash memory technology for easy reprogramming and updating of firmware, enabling flexibility and future-proofing of the device.

Terminal Pitch: 0.5 mm

Provides fine pitch spacing for compact placement on circuit boards, maximizing space efficiency and allowing for high-density designs.

Moisture Sensitivity Level (MSL): 3

Indicates the degree of protection required during storage and handling, ensuring the reliability and performance of the microcontroller in various environments.

Speed: 100 rpm

Operates at a fast speed for efficient data processing and communication, meeting the demands of real-time applications.

No. of I/O Lines: 74

Provides a sufficient number of input/output lines for connecting with external devices and peripherals, enabling versatile functionality and interface options.

Technical Specifications

Microcontrollers F28M35H22C1RFPQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H22C1RFPQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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