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F28M35H22B1RFPS

Texas Instruments

F28M35H22B1RFPS by Texas Instruments

The Texas Instruments F28M35H22B1RFPS microcontroller features a 32-bit CPU with 524288 ROM words and 139264 RAM bytes. With a max clock frequency of 20 MHz, it is suitable for automotive applications requiring high-speed processing and ADC/DAC capabilities. This microcontroller operates in temperatures ranging from -40 to 125 °C and offers various power supply options including 1.2V, 1.8V, and 3.3V for versatile design integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,895 parts In-Stock

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2,895

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Vyrian

USA . 1,946 parts In-Stock

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1,946

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 382 parts In-Stock

1+ parts

$0.319

100+ parts

-

1k+ parts

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$0.306

382

$0.319

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-

$0.306

Northwest PG Solutions

USA . 1,467 parts In-Stock

1+ parts

$0.351

100+ parts

-

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$0.309

1,467

$0.351

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$0.309

AZTECH Wire

Italy . 364 parts In-Stock

1+ parts

$12.707

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364

$12.707

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One Stop Electronics

USA . 924 parts In-Stock

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$34.000

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924

$34.000

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Parana Technologies

USA . 900 parts In-Stock

1+ parts

$64.092

100+ parts

$5,951.957

1k+ parts

$57.683

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900

$64.092

$5,951.957

$57.683

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DigiPath Technology Company

USA . 1,295 parts In-Stock

1+ parts

$70.574

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1,295

$70.574

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ChromeModa Solutions

Germany . 2,096 parts In-Stock

1+ parts

$72.014

100+ parts

$59.051

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2,096

$72.014

$59.051

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IDEA Electronic Components Group

UK . 556 parts In-Stock

1+ parts

$72.014

100+ parts

$68.413

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$64.813

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556

$72.014

$68.413

$64.813

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Corphita

USA . 2,890 parts In-Stock

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2,890

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Overview

Unlock the power of innovation with the F28M35H22B1RFPS microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial automation, this cutting-edge microcontroller delivers exceptional value with its advanced features and capabilities. Experience seamless integration and unmatched efficiency with the F28M35H22B1RFPS, setting new standards in the world of microcontrollers. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 1.26 V

This voltage range ensures compatibility with a variety of power supplies, making it versatile for different applications.

Bit Size: 32

A 32-bit architecture allows for faster and more efficient processing of data, making the microcontroller suitable for handling complex tasks.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to convert digital signals into analog output, expanding its capabilities for interfacing with sensors and actuators.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages gives flexibility in designing systems with different power requirements, enhancing the microcontroller's compatibility.

No. of Terminals: 144

Having a high number of terminals allows for more connections and interfaces, enabling the microcontroller to communicate with various external devices and peripherals.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures energy efficiency and extends battery life in applications that require power conservation.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, the microcontroller can function reliably in harsh environments with elevated temperatures.

CPU Family: CORTEX-M3

Based on Cortex-M3 architecture, this microcontroller offers high performance and energy efficiency, making it suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures allows the microcontroller to be used in cold climates or industrial settings with extreme temperature conditions.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to read analog signals from sensors, providing accurate data acquisition and processing capabilities.

DMA Channels: YES

Direct memory access channels enhance the microcontroller's ability to transfer data between peripherals and memory without CPU intervention, improving overall system performance.

ROM Words: 524288

With a large ROM capacity, the microcontroller can store a significant amount of program code and data, enabling complex applications to be executed efficiently.

Maximum Seated Height: 1.2 mm

The low seated height of the package ensures compatibility with compact designs, making it suitable for space-constrained applications.

Width: 20 mm

Compact width dimensions allow for easy integration into PCB layouts, saving space and enabling efficient placement within electronic systems.

Maximum Clock Frequency: 20 MHz

A high clock frequency allows the microcontroller to execute instructions quickly, enhancing overall system responsiveness and performance.

Length: 20 mm

The compact length of the microcontroller fits well within small form factor designs, offering flexibility in product configurations and layouts.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets stringent temperature and reliability requirements for use in vehicles and automotive electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

Having a RISC-based microcontroller architecture offers high performance and efficiency, making it ideal for real-time processing and control applications.

RAM Bytes: 139264

With a large RAM capacity, the microcontroller can efficiently handle data storage and manipulation, supporting multitasking and memory-intensive tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for diverse applications.

Terminal Form: GULL WING

Gull wing terminals offer secure and reliable connections for soldering, ensuring robust electrical connections in the microcontroller's interface with external components.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, contributing to system performance and longevity.

PWM Channels: YES

Pulse width modulation channels enable precise control of signals for applications such as motor control and power management, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and efficient updates of program code, enabling flexibility in development and maintenance of the microcontroller's firmware.

Terminal Pitch: 0.5 mm

Having a small terminal pitch facilitates high-density mounting of the microcontroller on PCBs, enabling compact and space-efficient designs.

Speed: 100 rpm

With a speed of 100 rpm, this microcontroller can process instructions rapidly, making it suitable for applications requiring high-speed data processing and control.

No. of I/O Lines: 74

The abundance of I/O lines provides versatility in interfacing with external devices and peripherals, making the microcontroller suitable for a wide range of applications.

Technical Specifications

Microcontrollers F28M35H22B1RFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H22B1RFPS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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