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F28M35H32B1RFPS

Texas Instruments

F28M35H32B1RFPS by Texas Instruments

Texas Instruments F28M35H32B1RFPS is a 32-bit microcontroller with 144 terminals, operating at -40 to 125 °C. Features include DAC and ADC channels, ROM of 786432 words, and RAM of 139264 bytes. Ideal for automotive applications due to its CMOS technology and PWM capabilities up to 100 rpm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,515 parts In-Stock

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Vyrian

USA . 309 parts In-Stock

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309

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Distributors (Availability)

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Native Components

USA . 516 parts In-Stock

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$7.930

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516

$7.930

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Northwest PG Solutions

USA . 56 parts In-Stock

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$8.723

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$7.851

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56

$8.723

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One Stop Electronics

USA . 455 parts In-Stock

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$13.000

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455

$13.000

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AZTECH Wire

Italy . 869 parts In-Stock

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$17.962

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869

$17.962

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Parana Technologies

USA . 653 parts In-Stock

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$47.847

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653

$47.847

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DigiPath Technology Company

USA . 1,801 parts In-Stock

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$52.686

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$48.471

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$52.686

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ChromeModa Solutions

Germany . 4,111 parts In-Stock

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$53.761

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$44.084

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$53.761

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IDEA Electronic Components Group

UK . 641 parts In-Stock

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$53.761

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$51.073

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$48.385

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641

$53.761

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Corphita

USA . 335 parts In-Stock

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Overview

Unlock endless possibilities with the F28M35H32B1RFPS microcontroller by Texas Instruments. Designed with precision and expertise, this microcontroller offers unmatched quality and reliability. Ideal for a wide range of applications, this powerful device provides customers with unparalleled value, benefits, and advantages. Experience seamless performance and efficiency with the F28M35H32B1RFPS, setting new standards in the world of microcontrollers. Let Texas Instruments elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

The surface mount capability makes it easy to integrate this microcontroller onto a PCB, saving space and enabling efficient assembly processes.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Package Shape: SQUARE

The square shape allows for easier placement and alignment on the circuit board, improving overall design aesthetics and functionality.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger data sets and provide faster processing speeds, suitable for complex applications.

DAC Channels: YES

Having DAC channels allows for precise control of analog outputs, making it ideal for applications such as audio processing and motor control.

Power Supplies (V): 1.2,1.8,3.3

The variety of power supply options enables flexibility in design and compatibility with different voltage requirements of peripherals and sensors.

No. of Terminals: 144

The high number of terminals provides ample connectivity options for interfacing with external components, expanding the functionality of the microcontroller.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even in low-power scenarios, enhancing the product's versatility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes this microcontroller suitable for automotive and industrial applications where heat resistance is essential.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family indicates high performance, low power consumption, and extensive feature set, ensuring optimal functionality and efficiency.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to operate in extreme cold conditions, making it suitable for outdoor and harsh environments.

ADC Channels: YES

The presence of ADC channels enables precise analog-to-digital conversions, essential for sensor interfacing and data acquisition applications.

DMA Channels: YES

Having DMA channels reduces the burden on the CPU for data transfer, improving overall system performance and efficiency.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connection, enhancing the ease of assembly and maintenance of the product.

ROM Words: 786432

With a large ROM capacity, this microcontroller can store extensive program codes and data, suitable for applications requiring ample memory space.

Maximum Seated Height: 1.2 mm

The low seated height profile allows for compact and slim designs, ideal for space-constrained applications and products.

Width: 20 mm

The moderate width dimension provides a good balance between space efficiency and ease of handling during PCB integration and assembly.

Maximum Clock Frequency: 20 MHz

The high clock frequency enables fast data processing and execution speed, essential for real-time applications and high-performance tasks.

Length: 20 mm

The standard length dimension offers compatibility with common PCB footprints and design layouts, ensuring easy integration into existing systems.

Temperature Grade: AUTOMOTIVE

Being automotive-grade indicates reliability, durability, and performance under challenging conditions, making it suitable for automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller ensures efficient instruction execution, optimal performance, and low power consumption, suitable for a wide range of applications.

RAM Bytes: 139264

The large RAM capacity allows for efficient data storage and processing, enabling multitasking and running complex algorithms without performance degradation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of peripherals and sensors, enhancing the product's versatility.

Terminal Form: GULL WING

The Gull Wing terminal form factor offers secure solder joints and easy reworkability, ensuring reliable connections and simplifying manufacturing processes.

Nominal Supply Voltage: 1.2 V

The stable and optimal nominal supply voltage ensures consistent performance and power efficiency, prolonging the lifespan of the microcontroller.

PWM Channels: YES

Having PWM channels allows for precise control of pulse-width modulation signals, essential for applications such as motor speed control and LED brightness adjustment.

ROM Programmability: FLASH

The Flash ROM programmability enables easy updates and reprogramming of firmware, ensuring flexibility and scalability for future enhancements and optimizations.

Terminal Pitch: 0.5 mm

The narrow terminal pitch provides high-density mounting capability, saving space and allowing for more compact and lightweight product designs.

Speed: 100 rpm

The high rotational speed capability makes this microcontroller suitable for applications requiring fast data processing, communication, and control tasks.

No. of I/O Lines: 74

The abundant I/O lines offer versatile connectivity options for interfacing with various external devices, sensors, and peripherals, enhancing the product's versatility and compatibility.

Technical Specifications

Microcontrollers F28M35H32B1RFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H32B1RFPS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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