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F28M35H20B1RFPS

Texas Instruments

F28M35H20B1RFPS by Texas Instruments

The Texas Instruments F28M35H20B1RFPS microcontroller features a 32-bit CPU, 144 terminals, and 74 I/O lines. With DAC and ADC channels, it is ideal for automotive applications requiring a max clock frequency of 20 MHz. Operating b/w -40 to 125 °C, this Cortex-M3 device offers ROM programmability with 524288 words.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,113 parts In-Stock

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Digiode

USA . 553 parts In-Stock

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553

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One Stop Electronics

USA . 611 parts In-Stock

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$4.000

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611

$4.000

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AZTECH Wire

Italy . 490 parts In-Stock

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$13.008

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$13.008

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Native Components

USA . 334 parts In-Stock

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$27.985

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334

$27.985

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Northwest PG Solutions

USA . 1,996 parts In-Stock

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$30.784

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$27.705

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$30.784

$27.705

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Parana Technologies

USA . 922 parts In-Stock

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$38.020

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922

$38.020

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DigiPath Technology Company

USA . 1,737 parts In-Stock

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$41.865

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$38.515

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1,737

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$38.515

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IDEA Electronic Components Group

UK . 704 parts In-Stock

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$42.719

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$40.583

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$38.447

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704

$42.719

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$38.447

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ChromeModa Solutions

Germany . 546 parts In-Stock

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$42.719

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$35.030

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Corphita

USA . 2,865 parts In-Stock

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Overview

Elevate your projects with the F28M35H20B1RFPS microcontroller from Texas Instruments, a leading manufacturer in the industry. Ideal for a wide range of applications, this powerful 32-bit microcontroller offers unmatched performance and reliability. With features like DAC and ADC channels, DMA capabilities, and a maximum clock frequency of 20MHz, this microcontroller provides exceptional value and versatility to customers. Whether you're working on automotive or industrial projects, trust Texas Instruments to deliver top-of-the-line quality and innovation with the F28M35H20B1RFPS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight yet durable, making the microcontroller suitable for a wide range of applications.

Surface Mount: YES

Easily mountable on circuit boards, saving space and allowing for efficient assembly processes.

Maximum Supply Voltage: 1.26 V

Efficient power management and low power consumption, making it ideal for portable or battery-operated devices.

Package Shape: SQUARE

Space-efficient design for compact circuit layouts.

Bit Size: 32

High processing power for handling complex tasks and calculations.

DAC Channels: YES

Ability to produce precise analog voltage outputs, enabling interface with external analog devices.

Power Supplies (V): 1.2, 1.8, 3.3

Versatile power supply options for compatibility with different voltage requirements in various applications.

No. of Terminals: 144

Sufficient number of terminals for connecting to other components and peripherals in a system.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Various package styles to suit different mounting and cooling requirements, offering flexibility in design.

Minimum Supply Voltage: 1.14 V

Wide operating voltage range for stability and performance across varying input voltages.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments such as automotive or industrial applications.

CPU Family: CORTEX-M3

Advanced processor architecture with high efficiency and performance for demanding tasks.

Minimum Operating Temperature: -40 °C

Suitable for use in extremely cold climates or industrial freezers without compromising performance.

ADC Channels: YES

Analog-to-Digital conversion capability for interfacing with analog sensors or signals.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing, reducing CPU load.

Terminal Position: QUAD

Quad position terminals for ease of connectivity and routing in a circuit layout.

ROM Words: 524288

Large amount of Read-Only Memory for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications or slim devices.

Width: 20 mm

Compact size for integration into small form factor electronics.

Maximum Clock Frequency: 20 MHz

Fast clock speed for rapid data processing and device responsiveness.

Length: 20 mm

Compact dimensions for fitting into tight spaces or small enclosures.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for improved efficiency and speed in executing instructions.

RAM Bytes: 73728

Substantial Random Access Memory for temporary data storage and fast access during operation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity in electronic circuits.

Terminal Form: GULL WING

Gull wing terminals for secure soldering and reliable connections on PCBs.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for consistent performance and reliable operation.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog signals and motors.

ROM Programmability: FLASH

Flash ROM for programmability and flexibility in updating firmware or software.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and space-saving circuit layouts.

Speed: 100 rpm

High processing speed for quick response to inputs and efficient operation.

No. of I/O Lines: 74

Abundant Input/Output lines for connectivity with external devices and components.

Technical Specifications

Microcontrollers F28M35H20B1RFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

73728

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H20B1RFPS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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