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F28M35H20B1RFPQ

Texas Instruments

F28M35H20B1RFPQ by Texas Instruments

The Texas Instruments F28M35H20B1RFPQ microcontroller features a 32-bit CPU, 74 I/O lines, and 73728 bytes of RAM. With a max clock frequency of 20 MHz, it is ideal for automotive applications requiring high-speed processing and control capabilities. This microcontroller supports ADC and DAC channels, making it suitable for various automotive control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,550 parts In-Stock

1+ parts

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4,550

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Vyrian

USA . 3,722 parts In-Stock

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3,722

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 415 parts In-Stock

1+ parts

$10.000

100+ parts

-

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415

$10.000

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AZTECH Wire

Italy . 197 parts In-Stock

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$13.397

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197

$13.397

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Parana Technologies

USA . 275 parts In-Stock

1+ parts

$54.829

100+ parts

$5,091.736

1k+ parts

$49.346

10k+ parts

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275

$54.829

$5,091.736

$49.346

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DigiPath Technology Company

USA . 1,285 parts In-Stock

1+ parts

$60.374

100+ parts

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1,285

$60.374

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ChromeModa Solutions

Germany . 6,381 parts In-Stock

1+ parts

$61.606

100+ parts

$50.517

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6,381

$61.606

$50.517

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IDEA Electronic Components Group

UK . 778 parts In-Stock

1+ parts

$61.606

100+ parts

$58.526

1k+ parts

$55.445

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778

$61.606

$58.526

$55.445

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Native Components

USA . 925 parts In-Stock

1+ parts

$198.294

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$190.362

925

$198.294

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$190.362

Northwest PG Solutions

USA . 345 parts In-Stock

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$218.123

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345

$218.123

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Corphita

USA . 424 parts In-Stock

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424

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Overview

Unleash the power of cutting-edge technology with the F28M35H20B1RFPQ microcontroller by Texas Instruments! Designed for automotive applications, this high-quality device offers unparalleled performance and reliability. With advanced features like DAC and ADC channels, DMA support, and a fast 20 MHz clock frequency, this microcontroller is perfect for precision control systems. Experience seamless operation and robust functionality with Texas Instruments' trusted expertise in semiconductor manufacturing. Upgrade your projects today with the F28M35H20B1RFPQ and unlock a world of possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a long lifespan.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.26 V

Ensures compatibility with a variety of power sources, making the microcontroller versatile for different applications.

Screening Level: AEC-Q100

Complies with automotive quality standards, ensuring reliability and performance in automotive environments.

Package Shape: SQUARE

Optimal shape for efficient space utilization on circuit boards, allowing for compact designs.

Bit Size: 32

High-bit size allows for complex data processing and execution, making the microcontroller suitable for demanding tasks.

DAC Channels: YES

Presence of DAC channels enables the microcontroller to interface with analog components, expanding its functionality.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supply options makes the microcontroller adaptable to various voltage requirements.

No. of Terminals: 144

Abundance of terminals allows for extensive connectivity options and interfaces with other components.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Diverse package styles offer flexibility in integration and mounting options for different design requirements.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures efficient power usage and extends battery life in portable devices.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliable performance in harsh environmental conditions.

CPU Family: CORTEX-M3

Utilizes a powerful and efficient CPU architecture for fast processing speeds and optimal performance.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures enables the microcontroller to function in extreme cold environments.

ADC Channels: YES

Integrated ADC channels facilitate analog-to-digital conversion, enabling precise measurements and sensor interfacing.

DMA Channels: YES

DMA capability reduces CPU workload by offloading data transfer tasks, enhancing overall system efficiency.

Terminal Position: QUAD

Quad terminal configuration simplifies PCB layout and increases signal integrity for reliable connections.

ROM Words: 524288

Large ROM capacity accommodates extensive program storage, allowing for complex algorithms and code execution.

Maximum Seated Height: 1.2 mm

Low seated height minimizes space requirements, ideal for slim and compact device designs.

Width: 20 mm

Compact width dimension allows for versatile placement and integration in various electronic applications.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast data processing and execution, suitable for real-time applications.

Length: 20 mm

Optimal length dimension for space-efficient design layouts and compact form factor.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements, ensuring reliable operation in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Incorporates a RISC-based microcontroller design for efficient and streamlined data processing capabilities.

RAM Bytes: 73728

Generous RAM capacity enables data storage and manipulation, supporting multi-tasking and memory-intensive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, extending battery life and reducing heat dissipation.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder connections and mechanical strength for robust PCB assembly.

Nominal Supply Voltage: 1.2 V

Consistent nominal supply voltage ensures stable performance and compatibility with standard power sources.

PWM Channels: YES

PWM channels enable precise control of analog outputs, suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM technology allows for easy and efficient program updates, enhancing flexibility and scalability.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high density packaging, saving board space and enabling miniaturization.

Speed: 100 rpm

Fast processing speed ensures quick response times and efficient operation in time-critical applications.

No. of I/O Lines: 74

Abundance of I/O lines offers versatile interfacing options with external devices and peripherals.

Technical Specifications

Microcontrollers F28M35H20B1RFPQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

73728

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H20B1RFPQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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