Loading...

F28M35H20C1RFPS

Texas Instruments

F28M35H20C1RFPS by Texas Instruments

The Texas Instruments F28M35H20C1RFPS microcontroller features a 32-bit CPU with 524288 ROM words and 73728 RAM bytes. With a max clock frequency of 20 MHz, it is suitable for automotive applications requiring high-speed processing and control, offering ADC and DAC channels along with PWM functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,725

-

-

-

-

Digiode

USA . 2,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,721

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$12.407

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$12.407

-

-

-

Native Components

USA . 633 parts In-Stock

1+ parts

$25.369

100+ parts

-

1k+ parts

-

10k+ parts

-

633

$25.369

-

-

-

Northwest PG Solutions

USA . 627 parts In-Stock

1+ parts

$27.906

100+ parts

$25.116

1k+ parts

-

10k+ parts

-

627

$27.906

$25.116

-

-

One Stop Electronics

USA . 1,484 parts In-Stock

1+ parts

$31.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,484

$31.000

-

-

-

Parana Technologies

USA . 405 parts In-Stock

1+ parts

$77.167

100+ parts

-

1k+ parts

-

10k+ parts

-

405

$77.167

-

-

-

DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$84.971

100+ parts

$78.173

1k+ parts

-

10k+ parts

-

650

$84.971

$78.173

-

-

ChromeModa Solutions

Germany . 6,710 parts In-Stock

1+ parts

$86.705

100+ parts

$71.098

1k+ parts

-

10k+ parts

-

6,710

$86.705

$71.098

-

-

IDEA Electronic Components Group

UK . 1,211 parts In-Stock

1+ parts

$86.705

100+ parts

$82.370

1k+ parts

$78.034

10k+ parts

-

1,211

$86.705

$82.370

$78.034

-

Corphita

USA . 4,264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,264

-

-

-

-

Overview

Unleash the power of innovation with the F28M35H20C1RFPS microcontroller by Texas Instruments. Designed to meet the highest standards of quality and reliability, this versatile device is perfect for a wide range of applications in industries such as automotive, consumer electronics, and industrial automation. With its advanced features and cutting-edge technology, the F28M35H20C1RFPS offers unmatched performance, efficiency, and flexibility. Trust Texas Instruments to deliver superior products that will take your projects to the next level. Experience the difference with the F28M35H20C1RFPS today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, helping ensure longevity of the microcontroller.

Surface Mount: YES

Ease of installation and integration into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

Efficient power usage and compatibility with various power sources.

Package Shape: SQUARE

Allows for easy placement and efficient use of space on circuit boards.

Bit Size: 32

High processing power and capability for complex tasks and applications.

DAC Channels: YES

Ability to generate analog signals, useful for various applications like audio processing and sensor interfacing.

Power Supplies (V): 1.2, 1.8, 3.3

Versatile power options to accommodate different voltage requirements and applications.

No. of Terminals: 144

Sufficient connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Various package styles for flexibility in design and integration based on specific project needs.

Minimum Supply Voltage: 1.14 V

Ability to operate efficiently even at low power levels, increasing energy efficiency.

Maximum Operating Temperature: 125 °C

Suitable for use in automotive and industrial settings where high temperatures may be encountered.

CPU Family: CORTEX-M3

Reliable and efficient processing capabilities for handling a wide range of tasks and applications.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, making it suitable for a variety of environments.

ADC Channels: YES

Ability to convert analog signals to digital data, essential for interfacing with sensors and real-world inputs.

DMA Channels: YES

Efficient data transfer between peripherals and memory, enabling high-speed and reliable data processing.

Terminal Position: QUAD

Organized terminal layout for easy connections and reduced risk of errors during installation.

ROM Words: 524288

Sufficient memory capacity for storing program code and data, allowing for complex applications to be run.

Maximum Seated Height: 1.2 mm

Low-profile design for compact and space-saving installation in electronic devices.

Width: 20 mm

Compact size for versatile placement and integration in various electronic devices and systems.

Maximum Clock Frequency: 20 MHz

High-speed processing capability for efficient and responsive operation of applications.

Length: 20 mm

Compact size for efficient use of space on circuit boards and electronic devices.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive environments, ensuring reliable operation in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

Specifically designed for microcontroller applications, offering efficient and reliable performance.

RAM Bytes: 73728

Sufficient random-access memory for temporary data storage and processing, enhancing multitasking capabilities.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation, ideal for battery-powered devices.

Terminal Form: GULL WING

Robust terminal design for secure connections and durability in various operating conditions.

Nominal Supply Voltage: 1.2 V

Stable and efficient power supply for consistent and reliable performance of the microcontroller.

PWM Channels: YES

Ability to generate pulse-width modulation signals for controlling various devices and components.

ROM Programmability: FLASH

Flash memory for programmability and data storage, enabling easy updates and flexibility in applications.

Terminal Pitch: 0.5 mm

Fine pitch for compact layout and space-saving installation on circuit boards.

Speed: 100 rpm

Fast processing speed for quick execution of tasks and real-time applications.

No. of I/O Lines: 74

Versatile input/output options for interfacing with external devices and components, expanding functionality.

Technical Specifications

Microcontrollers F28M35H20C1RFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

73728

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H20C1RFPS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19