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F28M35E20B1RFPS

Texas Instruments

F28M35E20B1RFPS by Texas Instruments

Texas Instruments F28M35E20B1RFPS microcontroller features 32-bit architecture, 6-Ch 10-Bit DAC, and 10-Ch 12-Bit ADC for automotive applications. With a max clock frequency of 60 MHz, it offers low power mode and connectivity options like I2C, CAN, and USB. This CMOS technology device has 144 terminals in a square package with GULL WING terminal form.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,929 parts In-Stock

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Digiode

USA . 261 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 391 parts In-Stock

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$7.104

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Native Components

USA . 994 parts In-Stock

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$8.830

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Northwest PG Solutions

USA . 276 parts In-Stock

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$9.713

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$8.742

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One Stop Electronics

USA . 1,046 parts In-Stock

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$12.000

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Parana Technologies

USA . 871 parts In-Stock

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$23.426

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$24.059

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ChromeModa Solutions

Germany . 3,683 parts In-Stock

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$26.321

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$21.583

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IDEA Electronic Components Group

UK . 1,539 parts In-Stock

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$26.321

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$25.005

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$23.689

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Component Stockers USA

USA . 584 parts In-Stock

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$99.990

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Corphita

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DigiPath Technology Company

USA . 1,044 parts In-Stock

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Overview

Unlock the potential of your electronic design with the F28M35E20B1RFPS by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality microcontrollers for various applications. This product offers unmatched value with its cutting-edge features and benefits, including high-performance capabilities, low power consumption, and a wide range of connectivity options. Elevate your project with the reliability and precision that Texas Instruments is known for, and experience the advantages that the F28M35E20B1RFPS brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount design makes it easy to integrate this microcontroller onto circuit boards efficiently.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a low maximum supply voltage range, suitable for a variety of applications.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage capabilities.

Package Shape: SQUARE

Square shape package offers easy handling and placement on circuit boards.

Bit Size: 32

32-bit architecture provides high processing power and supports complex applications.

DAC Channels: YES

Digital-to-Analog Converters enable accurate conversion for analog output signals, expanding application possibilities.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages allows flexibility in design and integration into various systems.

No. of Terminals: 144

Having a high number of terminals allows for versatile connectivity options and integration with external components.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Variety of package styles cater to different design requirements and offer options for optimized thermal management.

Technical Specifications

Microcontrollers F28M35E20B1RFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

38

No. of External Interrupts:

3

No. of I/O Lines:

74

No. of Serial I/Os:

7

No. of Terminals:

144

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

73728

RAM Words:

72

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

150 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), CAN(2), SCI, SSI(4), SPI(5), UART(5), USB,"

Peripherals:

"CRC, DMA(38), PWM,TIMER(8), WDT(2)"

Analog To Digital Convertors:

10-Ch 12-Bit(2)

Digital To Analog Convertors:

6-Ch 10-Bit

Trade Compliance

F28M35E20B1RFPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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