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F28M35H32B1RFPQ

Texas Instruments

F28M35H32B1RFPQ by Texas Instruments

The Texas Instruments F28M35H32B1RFPQ microcontroller features a 32-bit CPU, 74 I/O lines, and 139264 bytes of RAM. With a max clock frequency of 20 MHz, it is suitable for automotive applications requiring high-speed processing and control capabilities. This microcontroller also offers ADC and DAC channels for analog signal processing in automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,403 parts In-Stock

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Digiode

USA . 2,136 parts In-Stock

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2,136

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Distributors (Availability)

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One Stop Electronics

USA . 170 parts In-Stock

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$1.000

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170

$1.000

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AZTECH Wire

Italy . 457 parts In-Stock

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$6.820

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457

$6.820

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Native Components

USA . 812 parts In-Stock

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$31.110

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$29.865

812

$31.110

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$29.865

Northwest PG Solutions

USA . 1,372 parts In-Stock

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$34.221

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1,372

$34.221

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Parana Technologies

USA . 1,082 parts In-Stock

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$37.673

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1,082

$37.673

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DigiPath Technology Company

USA . 1,371 parts In-Stock

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$41.482

100+ parts

$38.164

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$41.482

$38.164

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ChromeModa Solutions

Germany . 1,372 parts In-Stock

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$42.329

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$34.710

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$42.329

$34.710

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IDEA Electronic Components Group

UK . 611 parts In-Stock

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$42.329

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$40.213

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$38.096

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611

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$38.096

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Corphita

USA . 3,523 parts In-Stock

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Overview

Unleash the power of innovation with the F28M35H32B1RFPQ microcontroller from Texas Instruments. Designed with precision and reliability in mind, this cutting-edge device is perfect for a wide range of applications in the automotive industry and beyond. With its advanced features and high-quality construction, customers can expect unmatched performance and efficiency. Experience seamless operation and unparalleled functionality with the F28M35H32B1RFPQ microcontroller - where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and insulation for the microcontroller, making it durable and reliable for various applications.

Surface Mount: YES

Surface mounting allows for easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.26 V

Operates efficiently at low voltages, reducing power consumption and heat generation in the system.

Screening Level: AEC-Q100

Compliance with automotive industry standards ensures high reliability and quality for automotive applications.

Bit Size: 32

High bit size allows for complex computations and processing, suitable for advanced tasks and applications.

DAC Channels: YES

Integrated DAC channels provide analog output capabilities, expanding the range of possible applications.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages allows for flexible integration into various systems and environments.

No. of Terminals: 144

Having a large number of terminals provides more connectivity options and peripheral interface capabilities.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Variety of package styles offer versatility in design and mounting options for different applications and requirements.

Minimum Supply Voltage: 1.14 V

Operates reliably even at low supply voltages, ensuring consistent performance in various power conditions.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for automotive and industrial applications with demanding thermal conditions.

CPU Family: CORTEX-M3

Based on ARM Cortex-M3 architecture, providing high performance and energy efficiency for embedded applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, suitable for applications in cold environments or industrial freezers.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities, essential for sensor interfacing and data acquisition in various applications.

DMA Channels: YES

Integrated DMA channels facilitate efficient data transfer and processing, improving overall system performance and responsiveness.

Terminal Position: QUAD

Quad terminal position provides improved stability and reliability in connections, reducing the risk of signal or power loss.

ROM Words: 786432

Large ROM size allows for storing a significant amount of program code and data, accommodating complex software requirements.

Maximum Seated Height: 1.2 mm

Low profile design with a maximum seated height of 1.2mm allows for compact and space-efficient system integration.

Width: 20 mm

Compact width dimension enables easy placement and mounting on circuit boards, suitable for applications with limited space.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency provides fast processing and response times, ideal for real-time applications and high-speed data processing.

Length: 20 mm

Compact length dimension facilitates space-saving integration in small form factor devices or densely populated PCBs.

Temperature Grade: AUTOMOTIVE

Designed and tested for automotive temperature ranges, ensuring reliable operation in automotive electronic systems and environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design offers high performance and efficiency for embedded control applications, suitable for a wide range of tasks.

RAM Bytes: 139264

Large RAM size provides ample memory for data storage and manipulation, supporting complex algorithms and multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing overall performance and efficiency.

Terminal Form: GULL WING

Gull wing terminal form allows for robust solder connections, improving mechanical strength and reliability of the microcontroller.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, essential for critical applications.

PWM Channels: YES

Integrated PWM channels offer precise control over analog output signals, essential for motor control, lighting, and other applications.

ROM Programmability: FLASH

Flash programmability allows for convenient and flexible firmware updates, customization, and debugging of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and compact PCB design, suitable for space-constrained applications.

Speed: 100 rpm

Capable of high-speed operation at 100 rpm, suitable for applications requiring fast data processing or motor control tasks.

No. of I/O Lines: 74

Large number of I/O lines provide versatile connectivity options for interfacing with sensors, actuators, and external devices in complex systems.

Technical Specifications

Microcontrollers F28M35H32B1RFPQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

786432

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H32B1RFPQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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