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F28M35H22C1RFPT

Texas Instruments

F28M35H22C1RFPT by Texas Instruments

The Texas Instruments F28M35H22C1RFPT microcontroller features a 32-bit CPU, 6-Ch 10-Bit DAC, and 10-Ch 12-Bit ADC for industrial applications. With a max clock frequency of 20 MHz, it offers low power mode and connectivity options like I2C, CAN, and USB. This CMOS technology device has 74 I/O lines and operates in an industrial temperature range from -40 to 105°C.

Median Price

$32.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,754 parts In-Stock

1+ parts

$21.348

100+ parts

$18.647

1k+ parts

$12.860

10k+ parts

-

2,754

$21.348

$18.647

$12.860

-

Mouser Electronics

USA . 119 parts In-Stock

1+ parts

$32.950

100+ parts

$24.000

1k+ parts

$23.820

10k+ parts

-

119

$32.950

$24.000

$23.820

-

DigiKey

USA . 60 parts In-Stock

1+ parts

$32.950

100+ parts

$23.995

1k+ parts

-

10k+ parts

-

60

$32.950

$23.995

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,966 parts In-Stock

1+ parts

$20.178

100+ parts

-

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-

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1,966

$20.178

-

-

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Vyrian

USA . 7,070 parts In-Stock

1+ parts

-

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7,070

-

-

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

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-

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300

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 955 parts In-Stock

1+ parts

$18.050

100+ parts

-

1k+ parts

-

10k+ parts

-

955

$18.050

-

-

-

Corphita

USA . 826 parts In-Stock

1+ parts

$19.116

100+ parts

-

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-

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826

$19.116

-

-

-

Parana Technologies

USA . 1,528 parts In-Stock

1+ parts

$43.237

100+ parts

-

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-

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1,528

$43.237

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-

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DigiPath Technology Company

USA . 169 parts In-Stock

1+ parts

$47.609

100+ parts

-

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169

$47.609

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-

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IDEA Electronic Components Group

UK . 1,779 parts In-Stock

1+ parts

$48.581

100+ parts

$46.152

1k+ parts

$43.723

10k+ parts

-

1,779

$48.581

$46.152

$43.723

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ChromeModa Solutions

Germany . 229 parts In-Stock

1+ parts

$48.581

100+ parts

$39.836

1k+ parts

-

10k+ parts

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229

$48.581

$39.836

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-

Microchip USA

USA . 1,765 parts In-Stock

1+ parts

$57.660

100+ parts

$56.660

1k+ parts

$56.160

10k+ parts

$55.660

1,765

$57.660

$56.660

$56.160

$55.660

Lixinc

USA . 13,637 parts In-Stock

1+ parts

-

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13,637

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iodParts Technologies Inc.

India . 2,341 parts In-Stock

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2,341

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Kepictronics

USA . 2,150 parts In-Stock

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2,150

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Experience the cutting-edge technology of the F28M35H22C1RFPT microcontroller by Texas Instruments, leading the industry in innovation and quality. This versatile device is perfect for a wide range of applications, offering high performance and reliability. With its advanced features and flexible connectivity options, this microcontroller provides exceptional value to customers looking for efficient solutions. Trust in Texas Instruments to deliver top-notch products that elevate your projects to new heights. Upgrade to the F28M35H22C1RFPT and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring stable performance in different environmental conditions.

Maximum Supply Voltage: 1.26 V

Allows for efficient power usage and prevents damage to the microcontroller from overvoltage.

Bit Size: 32

High bit size allows for complex data processing and calculations, suitable for a wide range of applications.

No. of External Interrupts: 3

Enables the microcontroller to respond quickly to external events or signals, improving overall system responsiveness.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface with analog sensors or devices, expanding its application capabilities.

On Chip Program ROM Width: 8

Wide on-chip program ROM width allows for storing a large amount of program data, facilitating complex program execution.

Connectivity: "I2C(2), CAN(2), SCI, SSI(4), SPI(5), UART(5), USB,

Multiple connectivity options provide flexibility in connecting the microcontroller to other devices or systems, enhancing its compatibility and versatility.

Technical Specifications

Microcontrollers F28M35H22C1RFPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

38

No. of External Interrupts:

3

No. of I/O Lines:

74

No. of Serial I/Os:

7

No. of Terminals:

144

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

RAM Words:

136

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), CAN(2), SCI, SSI(4), SPI(5), UART(5), USB,"

Peripherals:

"CRC, DMA(38), PWM,TIMER(8), WDT(2)"

Analog To Digital Convertors:

10-Ch 12-Bit(2)

Digital To Analog Convertors:

6-Ch 10-Bit

Trade Compliance

F28M35H22C1RFPT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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